Global SemiConsortium

- Holst Centre:
- オランダのTNO (応用科学研究機構)とベルギーのIMECが共同で設立した研究所。フィリップス社の研究センターの跡地に設置。
- IME (Institute of Microelectronics)- A*STAR:
- シンガポールの科学技術研究庁 (A*STAR)傘下にある半導体研究所。LSIプロセスから実装 (3D IC)に至るまで、SiだけではなくGaNやSiCについても研究している。
- IMEC (Interuniversity Microelectronics Centre):
- ベルギーにある半導体技術の研究所。世界中から人材が集まり、半導体の設計、製造、応用などについて研究する。
- ITRI (Industrial Technology Research Institute ):
- 1973年に台湾で設立された研究開発機構。科学技術の研究開発により、産業発展と経済価値を創造し、社会福祉を促進することをミッションとする。
- LETI (Laboratoire d'Electronique des Technologies de I'information):
- フランスの科学技術庁CEAの中にある電子情報技術研究所。STMicroelectronicsなどと密に活動している。MEMS技術は定評がある。
- NMI (National Microelectronics Institute):
- 英国の半導体企業が集まる非営利の業界団体。
- SRC (Semiconductor Research Corp):
- 米国の半導体研究を推進する大学のコンソーシアム。
- 2022/4/26
- IME: Launch Of Smu-A*star Joint Lab In Social & Human-centred Computing
- 2022/4/25
- Imec Ramps Up the Development of the High-NA EUV Patterning Ecosystem
- 2022/4/8
- Leti: Leading Semiconductor Players to Advance Next Generation FD-SOI Roadmap for Automotive, IoT and Mobile Applications
- 2022/4/7
- IME: Innovating For Game-changing Green Technologies
- 2022/4/7
- SRC selected by NIST for critical roadmap work
- 2022/4/4
- Imec and Bühler Leybold enable high-throughput manufacturing of filter-on-chip CMOS sensors with unmatched precision
- 2022/3/24
- Leti: CEA and Startup C12 Join Forces to Develop Next-Generation Quantum Computers with Multi-Qubit Chips at Wafer Scale
- 2022/3/22
- Holst Centre: Bayflex Solutions Unveils First Continuous Testing Lab in Europe at Holst Centre
- 2022/3/22
- Imec.xpand II reaches an important milestone on its way to become one of world’s most impactful, early-stage funds dedicated to semiconductor innovation
- 2022/3/16
- IME: Developing Solutions with PSA to Manage AGV Fleets at Tuas Port
- 2022/3/8
- IME: A*STAR Sets Up New Research Institute To Support Singapore’s Sustainability Goals
- 2022/3/3
- ITRI and UCLA to Collaborate on World-Leading Memory Technology Development
- 2022/3/1
- ITRI and Pegatron Exhibit Taiwan’s First 5G O-RAN Energy-Saving Private Network Solution at MWC 2022
- 2022/3/1
- Leti: CEA and Spectronite Develop Software Radio For Spectrally Efficient Backhaul Solutions
- 2022/2/28
- Holst Centre: Imec Pioneers Ultra-Wideband Transmitter Chip That Pushes Data Rates up to 1.66Gb/s with Milliwatt Power.
- 2022/2/24
- Imec Pioneers Ultra-Wideband Transmitter Chip That Pushes Data Rates up to 1.66Gb/s with Milliwatt Power
- 2022/2/24
- ITRI, BizLink, and Japan Biotechno Pharma Launch iPMx Molecular Rapid Test System for COVID-19 in Japan
- 2022/2/22
- Imec, KU Leuven and PragmatIC Semiconductor demonstrate fastest 8-bit flexible microprocessor for low-power applications
- 2022/1/28
- ITRI and USC Launch Next-Generation Semiconductor Cooperation
- 2022/1/11
- SRC: Purdue-SRC partner in pursuit of advanced microelectronics, semiconductor workforce
- 2022/12/28
- ITRI: Heterogeneous Integration Chip-let System Package Alliance Established to Expand Market Opportunities
- 2021/12/23
- IME: Applied Materials and A*STAR’s Institute of Microelectronics Expand Research Collaboration to Accelerate Heterogeneous Chip Integration with Hybrid Bonding Technology
- 2021/12/22
- ITRI’s VLSI-TSA and VLSI-DAT Symposia Will Kick Off in April 2022
- 2021/12/15
- Leti: HfO2-Based FeRAM Arrays Designed & Fabricated at CEA-Leti Bring the Technology Closer to Manufacturability
- 2021/12/13
- Holst Centre: Thin and flexible scanner reads fingerprints from nail to nail
- 2021/12/13
- Imec demonstrates successful monolithic integration of Schottky diodes and depletion-mode HEMTs with 200 V GaN-IC
- 2021/12/2
- CEA-Leti Research Team Proposes New Approach for Next-Generation Memories with RRAM Energy-Storage Breakthrough
- 2021/11/26
- IME: A*STAR's IME & Stmicroelectronics Team Up On Silicon Carbide R&D For Ev Market, Industrial Applications
- 2021/11/18
- CEA-Leti Unveils Breakthrough for Mass-Market, High-Performance, Navigation-Grade Gyroscopes
- 2021/11/12
- ITRI-AIST Joint Symposium 2021 Held to Foster Technology Upgrades
- 2021/11/5
- NMI: Bosch to invest another $467 million to boost chipmaking capacity
- 2021/11/4
- ITRI and Oxford Instruments Foster Cooperation on Semiconductor Measurement Technology
- 2021/10/28
- Imec: Apple joins as first public partner in new imec research program that helps entire semiconductor value chain reduce its ecological footprint
- 2021/10/28
- ITRI and Catcher Technology Jointly Develop the Next-Generation Integrated Electrosurgery System
- 2021/10/20
- IME: SINGAPORE’S FIRST INTEGRATED SIMULATION MODEL OF VEHICLE ELECTRIFICATION CREATED BY A*STAR AND TUMCREATE
- 2021/10/14
- Imec signs licensing agreement with miDiagnostics to commercialize its patented technology for fast and reliable COVID-19 diagnosis based on exhaled breath
- 2021/10/13
- Holst Centre: TNO at Holst Centre develops smart sensor mat that detects heart rate, breathing rate, and posture
- 2021/10/1
- ITRI and Oxford Instruments Signed Agreement to Collaborate on Compound Semiconductors
- 2021/9/29
- NMI: SiliconCatalyst.UK and National Microelectronics Institute launch initiative for Semiconductor Start-ups
- 2021/9/23
- Imec And NeuroGyn AG Collaborate On Advanced Neurostimulation Device For Pelvic Nerve Disorders
- 2021/9/17
- ITRI, AITA, and UCLA CHIPS Forge Cooperation on AI Chip Development
- 2021/9/15
- IMEC: Dutch AI Semiconductor Startup Axelera AI Launches With $12 Million Seed Round
- 2021/9/13
- ITRI Provides Resources for Innovative IC Design Startups in Taiwan with Arm
- 2021/9/13
- Leti: CEA-Leti Proposes Nine Research Tracks to Guide ICT Industry’s Quest to Reduce its Carbon Footprint
- 2021/9/9
- Holst Centre: Partnering up to turn innovations into novel and feasible applications
- 2021/8/17
- IMEC: Xanadu and imec partner to develop photonic chips for fault tolerant quantum computing
- 2021/8/16
- Leti: A step closer to multi-time-scale neuromorphic chips
- 2021/7/27
- Holst Centre: Ultra-Wideband is gaining traction: 'accuracy down to the centimeter'
- 2021/7/26
- IMEC: Ultra-wideband is gaining traction: 'accuracy down to the centimeter'
- 2021/7/19
- Leti: Wafer-level testing of photonic circuits speeds up development
- 2021/7/14
- Holst Centre: Sensor-based wearable motion tracking – boosting patient wellbeing
- 2021/7/9
- Ualbany: Assessment Approach for 5G Edge Networks
- 2021/7/6
- Leti: In-memory computing could help improve circuit performance
- 2021/7/5
- Leti: NB-IoT: some adaptations for satellite communications
- 2021/6/29
- Imec’s Ultrasound Sensor Technology Yields Accurate Pulse Wave Velocity And Blood Pressure Values
- 2021/6/18
- A*star And Arcstone Open Joint Lab To Help Manufacturers Go Digital, Go Green
- 2021/6/17
- CEA-Leti reports record performance of nMOS devices fabricated with a maximum temperature of 500°C
- 2021/6/16
- Holst Centre: Launch of the TREASURE project
- 2021/6/15
- Imec Reports First Electrical Demonstration of Integrated Forksheet Devices to extend Nanosheets beyond 2nm technology node
- 2021/6/15
- CEA-Leti collaborates with siemens to launch process design kit that supports multiple technologies, simplifies creation of optical circuits
- 2021/6/3
- Imec Joins Forces With Sivers Photonics and ASM AMICRA to Accelerate Hybrid Integration of InP Lasers and Amplifiers with Silicon Photonics