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Global SemiConsortium

Global SemiConsortium

Holst Centre：: オランダのTNO（応用科学研究機構）とベルギーのIMECが共同で設立した研究所。フィリップス社の研究センターの跡地に設置。
IME（Institute of Microelectronics）：: シンガポールの半導体研究所。LSIプロセスから実装(3D IC)に至るまで、SiだけではなくGaNやSiCについても研究している。
IMEC（Interuniversity Microelectronics Centre）：: ベルギーにある半導体技術の研究所。世界中から人材が集まり、半導体の設計、製造、応用などについて研究する。
LETI（Laboratoire d'Electronique des Technologies de I'information）：: フランスの科学技術庁CEAの中にある電子情報技術研究所。STMicroelectronicsなどと密に活動している。MEMS技術は定評がある。
NMI（National Microelectronics Institute）：: 英国の半導体企業が集まる非営利の業界団体。
UAlbany：: 米ニューヨーク州立大学アルバニー校。半導体製造に力を入れ、世界の半導体研究の拠点の一つになっている。ニューヨーク州が熱心に資金提供。
SRC（Semiconductor Research Corp）：: 米国の半導体研究を推進する大学のコンソーシアム。
SEMATECH（Semiconductor Manufacturing Technology）：: 半導体プロセスの研究開発を行う米国のコンソーシアム。

2021/7/19: Leti: Wafer-level testing of photonic circuits speeds up development
2021/7/14: Holst Centre: Sensor-based wearable motion tracking – boosting patient wellbeing
2021/7/9: Ualbany: Assessment Approach for 5G Edge Networks
2021/7/6: Leti: In-memory computing could help improve circuit performance
2021/7/5: Leti: NB-IoT: some adaptations for satellite communications

2021/6/29: Imec’s Ultrasound Sensor Technology Yields Accurate Pulse Wave Velocity And Blood Pressure Values
2021/6/18: A*star And Arcstone Open Joint Lab To Help Manufacturers Go Digital, Go Green
2021/6/17: CEA-Leti reports record performance of nMOS devices fabricated with a maximum temperature of 500°C
2021/6/16: Holst Centre: Launch of the TREASURE project
2021/6/15: Imec Reports First Electrical Demonstration of Integrated Forksheet Devices to extend Nanosheets beyond 2nm technology node
2021/6/15: CEA-Leti collaborates with siemens to launch process design kit that supports multiple technologies, simplifies creation of optical circuits
2021/6/3: Imec Joins Forces With Sivers Photonics and ASM AMICRA to Accelerate Hybrid Integration of InP Lasers and Amplifiers with Silicon Photonics

2021/5/28: Holst Centre: New technology centre to accelerate digital innovation with the power of light
2021/5/28: CEA-Leti Introduces Plastic mmWave System for Applications Requiring Ultra-Low Latency and Ultra-High-Speed Connectivity
2021/5/25: CEA-Leti Unveils World’s First Autonomous Imager For Smartphones, Smart-Home Appliances and Automobiles
2021/5/20: Leti: Silicon can emit single photons at 1.28 microns

2021/4/29: Imec and AIXTRON Demonstrate 200 mm GaN Epitaxy on AIX G5+ C for 1200V Applications with Breakdown in Excess of 1800V
2021/4/22: Imec: Tandem breakthrough by solliance partners
2021/4/19: NMI: UK establishes first industrial supply chain for high-power SiC and GaN trench devices

2021/3/30: LETI: Enabling some of the world’s brightest color microdisplays
2021/3/26: IME: HDB and A*STAR Ink Collaborations to Advance Smart Construction Technologies and Facilitate Partnerships in Technology Transfer
2021/3/24: Leti: More resilient cybersecurity for IoT devices
2021/3/19: Imec demonstrates an ultra-sensitive, small optomechanical ultrasound sensor in silicon photonics
2021/3/11: CEA-Leti Previews the Future of Retinal Projection In Four Papers at Photonics West 2021
2021/3/10: Holst Centre: dpiX and TNO at Holst Centre Sign MOU to Formalize Partnership
2021/3/8: CEA-Leti Envisions Widespread Use of LiDAR Systems Based on Integrated Optical Phased Arrays (OPAs)
2021/3/5: IMEC: Cardiology Prepared For The Fourth Dimension
2021/3/3: Holst Centre: TNO at Holst Centre launches 3D battery spinoff LionVolt

2021/2/16: Imec Showcases World’s First Sub-5mW, IEEE 802.15.4z Ultra-Wideband Transmitter Chip
2021/2/11: Leti: Legrand and CEA combine their expertise to develop a new generation wireless and batteryless switch
2021/2/9: Imec Demonstrates 20nm Pitch Line/Space Resist Imaging with High-NA EUV Interference Lithography
2021/2/9: CEA-Leti Announces EU Project to Create Dynamically Programmable Wireless 6G Environments
2021/2/4: Leti: New EU Quantum Flagship consortium launches a project on silicon spin qubits as a platform for large-scale quantum computing
2021/2/4: Leti: French Team on Route Towards an Interposer Prototype for Quantum And Control Chips Integration at Very Low Temperature
2021/2/3: Leti: CEA Is the First Research Center to Acquire A Cryogenic Prober for Testing Quantum Bits
2021/2/2: Leti: New EU Quantum Flagship consortium launches a project on silicon spin qubits as a platform for large-scale quantum computing
2021/2/2: Leti: French Team on Route Towards an Interposer Prototype for Quantum And Control Chips Integration at Very Low Temperature
2021/2/2: CEA-Leti Team Paves the Way for Massive Integration of Qubits, Critical for Achieving Quantum Supremacy
2021/2/1: SRC Newsletter: January Issue
2021/2/1: SRC Connections at 2021 ISSCC

2021/1/28: The NMI Member Product Catalogue is an opportunity for our members to promote their products and services to the TechWorks communities.
2021/1/26: Imec: How working with imec’s hyperspectral experts helped fast-track success for the French startup, Tridimeo
2021/1/26: CEA-Leti Reports Breakthrough High-Performance Gyroscope For Automotive, Aeronautic and Industrial Applications
2021/1/21: Holst Centre: Discover our new Executive Report
2021/1/19: CEA-Leti Reports Machine-Learning Breakthrough That Opens Way to Edge Learning
2021/1/12: Looking back on imec’s highlights from 2020

2020/12/18: CEA-Leti Scientists Present In-Memory Computing Pathways for Edge-AI & Neural Networks with 3D Architectures & Resistive-RAM
2020/12/17: Imec presents smallest finFET-based biosensor for high-sensitivity molecule detection
2020/12/16: Leti: Aledia Announces it Has Produced its First Nanowire Chips on 300mm Silicon Wafers Using CEA-Leti Pilot Lines
2020/12/15: Imec Demonstrates Capacitor-less IGZO-Based DRAM Cell With >400s Retention Time
2020/12/15: CEA to Enable High-Performance Processors That Will Power Exascale Computing
2020/12/9: Imec Presents a Thin-Film Short-Wave-InfraRed Image Sensor with Sub-2µm Pixel Pitch
2020/12/3: Imec Applies Photolithography To Push Functionality and Reliability Barriers In OLED Display Manufacturing

2020/11/26: Imec and XIMEA launch industrial grade hyperspectral camera solution addressing the high-quality standards for machine vision applications
2020/11/18: Imec: New imec research program pursues the development of scalable and energy-efficient 6G device technology

2020/10/29: CEA-Leti to Build Quantum-Photonics Platform to Ensure Ultra-Secure Data for Finance, Energy, Defense and Other Industries
2020/10/28: Holst Centre: Advanced interactive surfaces by TNO at Holst Centre: consoles and control panels re-invented
2020/10/27: CEA-Leti Announces Collaboration with Intel to Advance Chip Design Through Cutting-Edge 3D Packaging Technologies
2020/10/23: Imec begins developing SARS-CoV-2 test to identify positive cases and confirm whether someone is contagious in less than five minutes
2020/10/20: Holst Centre: TNO at Holst Centre part of Madras project, a new European consortium
2020/10/13: CEA Achieves Mass-Spectrometry Breakthrough that Paves the Way to Detecting Viruses
2020/10/9: Imec presents alternative metals in advanced interconnect and contact schemes as a path to 2nm technology nodes
2020/10/3: Leti: Light Communications Alliance formed by Global Industry Leaders
2020/10/3: Leti and Partners in PiezoMAT Project Develop New Fingerprint Technology For Highly Reliable Security and ID Applications
2020/10/2: NMI: The NMI Directory 20/21 is now available to download

2020/9/25: IME: AI Tool to Enhance COVID-19 Screening

2020/8/28: Holst Centre: InSCOPE project boosts printed electronics past the research phase
2020/8/4: Imec presents low-power 60 GHz radar chip for contactless health tracking in battery-powered devices

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