AEC/APC Symposium Asia 2013

8:45

Registration

Plenary Session
Session Chair: Hidenori Kakinuma, Toshiba

9:15

Opening Remarks from AEC/APC Asia
Hidetaka Nishimura, Renesas Electronics

9:20

Program Outline
Hidenori Kakinuma, Toshiba

9:25

Keynote Speech
Engineering Innovation by CIM technology
Akio Oka, Toshiba

Session Co-chairs: Koichi Sakamoto, Tokyo Electron / Satoshi Yasuda, Panasonic

10:10

[PO-O-13] Improvement of Overall Equipment Efficiency by Virtual Metrology using Equipment data in Reactive Sputtering of Titanium Nitride
Presenter: Tomoya Tanaka, Panasonic Corporation

10:35

[PC-O-16] Effective Indicators to Monitor Polishing Uniformity and Pad Life Time in CMP Process
Presenter: Hirofumi Tsuchiyama, KATSUHISA SAKAI, Renesas Electronics

11:00

[PC-O-22] The VM/APC activities in Sony Semiconductor
Presenter: Shunsaku Yasuda, Sony Semiconductor

11:25

[TA-O-12] Big Data; Big Potential for Semiconductor Manufacturing Productivity Improvement
Presenter: Pramode Sutrave, Jamini Samantaray, Applied Materials

11:50

Lunch Break

Session Chair: Yuki Takayama, DISCO

12:50

Introduction for Poster ( 3mins )

Session Co-chairs: Yuki Takayama, DISCO / Takashi Kurosawa, Azbil

13:20

[CM-O-25] APC system with using Kalman filter
Presenter: Masamichi Kishimoto, Toshiba

13:45

[IN-O-06] Development of variable target type APC for NAND flash memories which utilized the T-CAD simulation
Presenter: TAKASHI TSURUGAI, Toshiba

14:10

[PO-O-19] Acoustic Emission Method for Detection of Micro-arc Discharge Around a Wafer
Presenter: Yuji Kasashima, National Institute of Advanced Industrial Science and Technology

14:35

[MT-O-20] Development of Characteristic Impedance Monitoring for Anomaly Detection
Presenter: Taisei Motomura, National Institute of Advanced Industrial Science and Technology

15:00

Supplier Exhibition / Coffee Break

Session Chair: Toshiya Hirai, Sony Semiconductor

15:30

Tutorial Speech
Applications of Soft-sensing Technology in Chemical Industries
Hideaki Yoshida, Sumitomo Chemical Company, Limited

Session Co-chairs: Toshiya Hirai, Sony Semiconductor / Hisato Tanaka, Tokyo Electron

16:30

[MT-O-23] Tool parameter unification and model-based key parameter calculation for Advanced Equipment Quality Management
Presenter: Michael Klick, Plasmetrex

16:55

[MT-O-07] Non-Destructive Surface States Measurement by Pulse Photoconductivity Method
Presenter: Masaaki Furuta, Junpei Fukashi, Ndagijimana Justin, Kumamoto University

17:20

[PC-O-14] Detection of temperature non-uniformity for spike annealing
Presenter: Nao Higuchi, Renesas Electronics

17:45

Closing / Best Paper Award and Student Award
Hidenori Kakinuma, Toshiba

18:05

Reception (Poster Session / Author's Interview / Supplier Exhibition)
Session Chair: Yuki Takayama, DISCO

[Poster] Introduction for short presentation for interactive poster session
Presenter: Yuki Takayama, DISCO

[PC-P-03] Predictive Metrology for Established Manufacturing Areas
Presenter: Jacob Orbon, Rudolph Technologies

[PO-P-10] Study development of particle detection technique in space using xenon flash lamp
Presenter: Takahiro SHIMIZU, Kumamoto University

[MT-P-09] Non-Destructive and Contactless Measurement by a Multi-electrode Tester
Presenter: Ndagijimana Justin, Junpei Fukashi, Kumamoto University

[MT-P-08] Fault Detection and Classification in Advanced Packaging
Presenter: Richard Beaver, Rudolph Technologies

[IN-P-18] The interaction between Scheduling and Engineering Operations in Product-mix Production with Q-time Constraints Processes
Presenter: Akihiro KOBAYASHI, Naoto Toyoshima, University of Tsukuba