Keynote Speaker
Shingo Kadomura
Sony Semiconductor Manufacturing Corporation
Executive Engineer
Biography
Shingo Kadomura started his career at Sony as a dry etching process engineer and later he was responsible for the game LSI development. Since 2009 he has been leading the engineering team to develop and start production of Back-Illuminated CMOS Image Sensors at Sony Semiconductor Manufacturing 300mm production line. He is currently an Executive Engineer at Sony Semiconductor Manufacturing.
Presentation Title
The manufacturing and future of Sony CMOS Image Sensor
Abstract
Image sensor is expected for applications such as smart phone, digital camera, automotive, industrial equipment and medical equipment.
Sony has been leading the market with high image quality, multi functional and high performance devices based on Back-Illuminated CMOS Image Sensor and various unique technologies.
To solve the issues of cost increasing due to the evolution of high performance devices, Sony Semiconductor Manufacturing is working on Smart Factory utilizing big data analysis and AI related technologies.
The strategy of Sony image sensor business, leading edge technologies and state of the art manufacturing will be introduced in the presentation.
Tutorial Speaker
Hideaki Takeda
National Institute of Informatics
Professor
Biography
Prof. Hideaki Takeda, Dr.,Eng.
Hideaki Takeda is a professor at National Institute of Informatics (NII), Japan, and a professor at the Graduate University for Advanced Studies (Sokendai).
He received Dr. Eng. degrees from the University of Tokyo, Japan in 1991.
He has been the Sumitomo endowed professor in the University of Tokyo between 2005 and 2010.
He is the chair of the Ethics Committee, Japanese Society for Artificial Intelligence (JSAI) since 2018.
He is also members of governmental committees such as Open Data Working Group by Cabinet Secretariat, the sub working group in the Conference toward AI Network Society by Ministry of Internal Affairs and Communications (MIC), Committee for Promotion of Information Sharing Infrastructure by Ministry of Economy, Trade and Industry (METI).
His interest includes Artificial Intelligence, in particular Semantic Web and Linked Open Data (LOD).
He has committed several projects by the government and private companies as the specialist of LOD.
He is also the president of Linked Open Data Initiative Inc. that promotes LOD technologies for public and private sectors.
Presentation Title
Semantic Web Technologies for data Interoperability: Ontology, Schema, and Linked Data
Abstract
Data interoperability is the key to utilize data within the domains as well as across the domains. Semantic Web technologies are developed in order to make information on the web both human and machine understandable. They are now realized as the core technologies to make data both human and machine understandable too. Providing the semantic layer for data is not just good for human understandability but also good for interoperability within and across the domains by bridging semantic gaps among data. In this talk, we introduce our two practices for data interoperability with Semantic Web technologies. One is building of ontologies for the specific domain. We built the ontologies for agriculture in order to make information and data in the domain more shareable and aggregative. The other is IMI: Common Vocabulary Framework where the schema for the basic concepts are provided to standardize open data.
Osamu Ohishi
IBM Japan Services Co., Ltd
Senior Architect
Biography
He received Bachelor of Informatics and Engineering from University of Electro-Communications in 1990 and then he has joined to IBM Japan. He had deployed MES of 200mm and 300mm semiconductor fabrication for several customers, and has worked for IBM Semiconductor MES Solution "SiView" since 2009.
He has joined SEMI JA GEM300 Task Force since 2012 and he has been the co-leader of SEMI E170 Application Study Working Group.
Presentation Title
Secured and Operation Oriented Recipe Management on SEMI Standard
Abstract
To make manufacturing line even smarter, fab data should be shared in wider area by more agents, and even higher security management scheme is essential. Also, for data consistency, data should be managed in centralized way per category.
In semiconductor factories, how to handle equipment recipes in conjunction with the wafer manufacturing operations is the most important information, and it should have good operability and consistency and be well protected. However, recipes in equipment are not well protected as the current GEM300 does not have any standardized security management scheme on recipes. The examples of the issues are:
- Distributed user authentications at large number of equipment
- Recipes are managed in a single recipe space in equipment without any partition per usages
- Recipe operations are performed at the same security level in a single recipe space, though they have different purposes and different security levels.
In the tutorial, the details of recipe operation, issues and the solution on SEMI Standard will be explained.
