Sponsorship
Thanks to the following companies who have pledged their financial support to ISSM2008. (alphabetic order)
- Applied Materials Japan Inc.
- DISCO CORPORATION
- Dura Systems Corporation
- Fujitsu Microelectronics Ltd.
- Hitachi High-Technologies Corporation.
- Hitachi ULSI Systems Co., Ltd.
- Intel Corporation
- KLA-Tencor Japan Ltd.
- NEC Electronics Corporation
- Nihon Ceratec CO.,LTD.
- Nihon Koshuha Co., Ltd.
- NIHON Micronics Co., Ltd.
- Nikon Corporation
- Nomura Micro Science Co., Ltd.
- Oki Electric Industry Co., Ltd.
- OMRON Corporation
- Panasonic Corporation
- PDF Solutions, Inc.
- Renesas Technology Corp.
- ROHM CO,.LTD.
- S.E.S. CO., LTD.
- Sanyo Semiconductor Co.,Ltd
- SEMATECH Inc.
- Semiconductor Leading Edge Technologies, Inc.
- Semiconductor Portal, Inc
- SEN Corporation,an SHI and Axcelis Company
- Sony Corporation
- Spansion Japan Limited
- Tokyo Electron Limited
- TOKYO SEIMITSU CO., LTD.
- TOSHIBA CORPORATION
- ULVAC, Inc.