Symposium Schedule

This program schedule is in JST (UTC +9)

9:00	Opening Remarks from AEC/APC Asia Hidetaka Nishimura Renesas Electronics
9:05	Program Outline Hidenori Kakinuma Kioxia Corporation

Session chair: Hidenori Kakinuma, Kioxia

9:10	Keynote Data Engineering and Analytics - the Enabler for "Zero Defect" Automotive Semiconductor Manufacturing Steven Frezon NXP View Abstract
9:55	Break

Session Co-chairs: Takashi Kurosawa, Azbil / Hisato Tanaka, Tokyo Electron

10:00	TDA-009 Online Learning for Run-by-run Prediction James F. Bramante INFICON View Abstract
10:20	MPC-017 Machine Learning-Based Optimization of Dose Uniformity for Ion Implantation Systems Christopher Lang Massachusetts Institute of Technology View Abstract
10:40	EPC-008 Quartz Crystal Microbalance for Real Time Deposition and Clean Endpoint Monitoring CHINCHIN TIEW INFICON View Abstract
11:00	EPC-0018 Anomaly Detection of Vibration Signals by Using the Number of their Harmonic Components Masahiro Yasuda ROHM Co., Ltd. View Abstract
11:20	Author's Interview1 Author's Interview & Break
11:40	Sponsors' VIDEO & Lunch Break

Session chair: Shunichi Shibuki, Sony Semiconductor Manufacturing

12:20	Tutorial Notable Deep Learning Related Trends and Its Utilization at Sony Yoshiyuki Kobayashi Sony View Abstract
13:05	Break

Session Co-chairs: Toshiya Hirai, KOKUSAI ELECTRIC / Koh Horimoto, IBM Japan Digital Services

13:10	EPC-013 False Alarm Reduction in AutoEncoder System by Using Our Original Waveform Extraction Method Yuki Ishizeki Renesas Electronics View Abstract
13:30	TDA-007 Anomary Detection of SEM images by using DeepLearning Ryosuke Kurosawa Sony Semiconductor Manufacturing View Abstract
13:50	TDA-014 Application of Contrastive Representation Learning to Unsupervised Defect Classification in Semiconductor Manufacturing Shota Mizukami Kioxia View Abstract
14:10	TDA-015 Interaction Modelings for Industrial Data - for final quality estimation and proess integration Qin Limin University of Tsukuba View Abstract
14:30	MPC-016 Development of Film Thickness Monitor Using Multiple Databases to Improve Robustness Against W2W Device Structure Fluctuation Soichiro Eto Hitachi View Abstract
14:50	Author's Interview2 Author's Interview & Break

Session chair: Kazutaka Nagashima, Toshiba Electronic Devices & Storage

15:10	Special Talk1 All Roads lead to a Sustainable World George Hoshi Tokyo Electron View Abstract
15:55	Sponsor Exhibition Hour and Break

Session chair: Osamu Ohishi, IBM Japan Digital Services

16:10	Special Talk2 IRDS Factory Integration Chapter - Focusing on APC/AEC related topics Supika Mashiro Tokyo Electron View Abstract
16:55	Break

Session Co-chairs: Hirofumi Tsuchiyama, INFICON / Takahiro Tsuchiya, United Semiconductor Japan

17:00	MPC-012 Enabling Machine Learning For Improved Tool Matching And Greater Process Control Ivan Tan Lam Research View Abstract
17:20	MPC-010 Development of Virtual Metrology Using Plasma Information Variables to Predict Si Etch Profile Processed by SF₆/O₂/Ar Capacitively Coupled Plasma Ji-Won Kwon Seoul National University View Abstract
17:40	TDA-011 An Approach to Create Trench Depth Prediction Model Xueting Wang TOSHIBA ELECTRONIC DEVICES & STORAGE View Abstract
18:00	EPC-019 Early detection of abnormal film thickness distribution by CNN Takumi Katoh Western Digital GK View Abstract
18:20	Author's Interview3 Author's Interview & Break