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- Schedule of Presentations and Speakers
- AEC/APC Symposium Asia 2015 Poster Session

Schedule of Presentations and Speakers

9:15	Registration Starts / Door Open
9:30	Opening Remarks from AEC/APC Asia Hidetaka Nishimura Renesas Electronics
9:35	Program Outline Hidenori Kakinuma Toshiba
Session Chair: Takashi Kurosawa, Azbil
9:40	Tutorial Speech-1 Tutorial on Applying the VM Technology for TFT-LCD Manufacturing Dr. Fan-Tien Cheng National Cheng Kung University
Session Co-chairs: Hisato Tanaka, Tokyo Electron / Tomoya Tanaka, TowerJazz Panasonic Semiconductor
10:40	[MC-O-30] Prediction and Stabilization of MOSFET Threshold Voltage by VM-APC using Factory Data Takayuki Uemura Sony Semiconductor View Abstract
11:00	[MC-O-39] Chamber matching of etching rate in HDP-CVD equipment Yoshiyuki Nakao Mie Fujitsu Semiconductor View Abstract
11:20	[MC-O-23] 製造プロセス全体のPLS回帰モデルを用いたMEMS製品特性の予測制御 Tomohiro Yoshimura OMRON
11:40	[PO-O-12] インピーダンス測定による新しい装置モニタリング手法 Yosuke Inoue Renesas Semiconductor Manufacturing View Abstract
12:00	Lunch Break & Supplier Exhibition
Session Chair: Yuki Takayama, DISCO
12:50	Introduction for Posters (3mins Summary Presentation)
Session Chair: Yuki Takayama, DISCO
13:20	Tutorial Speech-2 The new direction for providing effective data for EES from sensors and digital controllers Eisuke Toyoda Azbil
Session Co-chairs: Koichi Sakamoto, Tokyo Electron / Toshiya Hirai, Sony Energy Devices
14:05	[MT-O-18] APCシステムの導入によるLP-CVDプロセスの膜厚バラツキ及び生産性の改善 Masaki Ueda Toshiba View Abstract
14:25	[MT-O-45] Diagnosing Etch Chamber State Using RF Signals Masao Ito Lam Research View Abstract
14:45	[MT-O-32] EWMAを用いたFDC技術 Yuko Jisaki Panasonic Industrial Devices Engineering View Abstract
15:05	[MT-O-19] ウエーハ内変動パターンに同期した工程異常の検出 Masanobu Higashide Renesas Electronics View Abstract
15:25	Supplier Exhibition / Coffee Break
Session Chair: Hirofumi Tsuchiyama, Renesas Semiconductor Manufacturing
15:50	Keynote Speech Perspective on required packaging technologies for cognitive computing devices Yasumitsu Orii IBM Research Tokyo
Session Co-chairs: Takahiro Tsuchiya, Mie Fujitsu Semiconductor / Hirofumi Tsuchiyama, Renesas Semiconductor Manufacturing
16:20	[MT-O-37] Etch Run-to-Run Controller Optimization with ProcessWORKS Yulei Sun Rudolph Technologies View Abstract
16:40	[MT-O-22] Pad Crack detection by APC @ Aluminum Wire Bonding Dr. Michael Brüggemann Infineon View Abstract
17:00	[DA-O-31] Data driven modeling based on OES sensor for abnormal Vth monitoring in the OLED display process Jeong Jin Hong Samsung Display View Abstract
17:20	[DA-O-34] 高度装置/プロセス制御における機械学習とデータマイニングの応用 YiFan WANG University of Tsukuba View Abstract
17:40	[MT-O-41] 反射型レチクルフリー露光装置を用いた不均一伸縮基板対応アライメント方式の開発 Masahiro Nagano Kumamoto University View Abstract
18:00	Closing
18:10	Reception (Poster Session / Author's Interview / Supplier Exhibition)
19:30	Closing Remarks & Best Poster Award & Best Paper Award and Student Award Hidenori Kakinuma Toshiba

Short Presentation for interactive poster session (12:50-13:20)

Poster
Introduction for Poster

[MT-P-36] EESデータを用いた装置メンテナンス時の組み付け不具合の検知
Daisuke Tokiwa
Toshiba
View Abstract

[MT-P-21] パルス光伝導法によるLSI非接触テスティング
KOJIRO SHIMIZU
Kumamoto University (Graduate School of Science and Technology)
View Abstract

[MT-P-40] Real time contamination monitoring device development in the gas/chemical delivery line
Hong, Joo-Pyo
KOREATECH
View Abstract

[BA-P-25] Systematic Approach of APC to Enable Early Detection of Abnormal Pressure for TPMS Tire Pressure Monitoring Systems BE Testing Process
Teh Hui Fen
Infineon
View Abstract

[BA-P-42] 相関法を用いた空間流の微小パーティクルモニタリング手法の開発
Toshiaki Tanaka
Kumamoto University
View Abstract

[BE-P-38] 半導体Chip実装のための位置計測の一検討
Shinji Ueyama
Samsung
View Abstract

[CM-P-13] A Multi-step Wafer-level Run-to-Run Controller with Sampled Measurements for Furnace Deposition and CMP Process Flows
Yulei Sun
Rudolph Technologies
View Abstract

[DA-P-44] Advanced Trace Analytic Improves Root Cause Analysis for Yield Improvement
Tom Ho
BISTel America
View Abstract