Call for paper
CFP English Version
CFP 日本語版
Abstract Template
Scope of the Symposium
This call for paper is distributed to everyone associated with the process industry. We look forward to the posting as well as pre-process of semiconductor device manufacturers, and post-processing, equipment manufacturers who are heavily involved in process industry contents such as LCD and PV, software vendors, many of who are engaged in sensor and metrology supplier. Why don’t you join us having solid argument precisely because being age of rapid and dramatic change?
Important Dates
| Abstract Submission Start: | Monday, May 16, 2011 |
| Abstract Submission Due: | Friday, July 15, 2011 |
| Notification of Acceptance: | Friday, August 26, 2011 |
| Selected Final Presentation Due: | Friday, October 14, 2011 |
Areas of Interest
The symposium will be built around sessions such as (but not limited to) the following areas:
- Equipment and Process Fault Detection, Classification and Prediction
- Data Management and Process Control
- Metrology, Sensors, and Analytics
- Soft Sensor, Virtual Metrology
- Fab-wide AEC, APC, YM and Multi-fab Approaches
- Standard and Roadmaps
- Future Needs and Proposals
Online Submission
- Prospective authors are requested to submit the abstract through web browser, consisting of exactly two pages of A4-paper size.
- The first page consists of the text (max of 1,000 words) and the second page consists of figures, supporting data, charts, photos and drawings.
- Only MS Word and JPEG/GIF files are compatible.
- The abstract must be written in English, using online abstract submission form.
-
Submit electronically before June 30, 2011.
Submission information, templates, and other details are available on the website:
http://www.semiconportal.com/AECAPC/2011/cfp.html
Additional Details for the Areas of Interest
Topics on Contents related to processes and equipments
Equipment and Process control methodology:
- Fault detection and classification
- Statistical process control
- Run to run control
- Enhanced equipment quality assurance
Productivity & tool optimizations:
- Throughput up
- Uptime improvement
- Cost reduction
- Non-productive wafer reduction
- Maintenance
Model based process control:
- Physical and chemical process models
- Model-based sensors
- Virtual metrology
- Sampling plan
Tool data analysis:
- Data collection
- Failure and Yield Analysis
- Statistical approaches
- Non-statistical approaches
TOPICS ON FAB LEVEL
Data analysis, modeling and visualization:
- Data collection
- Correlation analysis
- Mathematical methods and model creation,
- Novel methods of data visualization and data analysis
Control methods:
- Run to run
- Real-time control
- Control algorithms
Benefit of APC application:
- CoO
- OEE
- Yield
- Productivity
- Environment, safety and health
APC Integration:
- Fab automation
- Scheduling and dispatch
- Yield management
- Design for manufacturing
- Supply chain management
IT infra structure for APC:
- Fab-wide APC
- Tool interfaces and communication
- Innovative IT solutions
APC strategy:
- Future Needs and opportunities