AEC/APC Symposium Asia 2011

8:45

Registration

Plenary Session
Session Chair: Hidenori Kakinuma, Toshiba Corp.

9:15

Opening Remarks from AEC/APC Asia 2011 Executive Committee Co-Chairs
Shigeru Kobayashi, Renesas Electronics Corp.

9:20

Program Outline
Eiichi Kawamura, Fujitsu Semiconductor Ltd.

9:25

Tutorial Session
"Does Virtual Sensing Technology Work at Your Workplace? - Proper Use of Process Data Analysis"
Dr. Manabu Kano, Kyoto University

10:30

Keynote Speech
"Hierarchical Process Control and Process Quality Management and Their Issues"
Shuichi Inoue, General Manager, Process Technology Division, Renesas Electronics Corp.

11:00

2011 Best paper
[PC-O-22] Stabilization of Etching Oxide Thickness using VM-APC of Polymer Wet Etching
Presenter: Masaki Kitabata, Panasonic Semiconductor Engineering
View Abstract

11:25

Lunch Break

Session Chair: Yuki Takayama, DISCO Corp.

12:25

3mins presentation
Poster Session Speakers and ISSM 2011 adapted paper Speakers

PO (Productivity & tool optimizations) / BA (Benefit of APC application) / DA (Data analysis, modeling and visualization)
Session Chair: Toshiya Hirai, Sony Semiconductor Corp. / Hisato Tanaka, Tokyo Electron Miyagi Ltd.

13:10

[PO-O-33] Prognostics and Health Management for Semiconductors - 1
Presenter: Moritaka Nakamura, ISMI
View Abstract

13:35

[BA-O-19] Yield enhancement at dicer equipment by implementation of APC Methods
Presenter: Lee Wei Fong Brian, Infineon
View Abstract

14:00

[BA-O-20] PECVD Chamber Cleaning End Time Detection (ETD) Using Optical EmissionSpectroscopy (OES) Data
Presenter: Ho Jae Lee, Myongji University
View Abstract

14:25

[DA-O-10] An Approach to Evaluate Greenhouse Gas Emissions in Wafer Fabrication Processes
Presenter: Naoki TANIMURA, Mizuho Information & Research Institute
View Abstract

14:50

[DA-O-25] Real-Time & Scalable Anomaly Detector based on Correlation Analysis
Presenter: Toshihiro Takahashi, IBM
View Abstract

15:15

[DA-O-26] Using DES for ROI calculations within semiconductor manufacturing
Presenter: Jochen Merhof, University Erlangen-Nürnberg, Institute for manufacturing automation and production systems
View Abstract

15:40

Supplier Exhibition / Coffee Break

PC(Model based process control) / MT(Equipment and Process control methodology)
Session Chair: Koichi Sakamoto, Tokyo Electron LTD. / Takashi Kurosawa, Yamatake Corp.

16:10

[PC-O-34] Frame for Virtual Metrology Implementation Technology Investigation from QC Operation Aspect
Presenter: Hidetaka NISHIMURA, Renesas Electronics
View Abstract

16:35

[PC-O-18] Virtual Metrology of Dry Etching Process Characteristics using EES and OES
Presenter: Kazuhiro Nomura, Sony Semiconductor
View Abstract

17:00

[MT-O-30] Spatially nano-meter difference method for improvement in sensitivity ofsmall particle detection
Presenter: Yudai Ito, Graduate School of Science and Technology, Kumamoto University
View Abstract

17:25

[MT-O-05] Developing smart FDC algorithms with domain knowledge and statistical methodologies
Presenter: Po Feng Tsai, TSMC
View Abstract

17:50

[MT-O-23] Maintenance-free Multivariate SPC by Using Correlation-based Just-In-Time Modeling
Presenter: Tomomi Ino, Toshiba
View Abstract

18:20

Special interaction session / Reception
Session Chair: Yuki Takayama, DISCO Corp.
Poster session, authors' interview, exhibits of AEC/APC products and ISSM 2011 adapted paper poster session all in one place with beverage provided

19:50

Closing Remarks from AEC/APC Asia 2011 Program committee co-chair
Hidenori Kakinuma, Toshiba Corp.

[PO-P-04] acts by using Equipment Engineering Data
Presenter: Tomio Iwata, Toshiba
View Abstract

[PO-P-27] Real-Time Arc Detection for FDC
Presenter: Hideki Ebisawa, INFICON
View Abstract

[BA-P-14] Abnormal Transfer Pressure Detection by APC
Presenter: Tan Kah Huat, Infineon
View Abstract

[BA-P-32] Litho APC optimizer
Presenter: Yasuhisa Iwata, KLA Tencor
View Abstract

[DA-P-09] Semiconductor Tool Monitoring by integrating defect signatures and in-line WIP
Presenter: Hai Ying, KLA Tencor
View Abstract

[DA-P-28] Interface A Enabled Applications: Uses of Detailed Equipment/Process Data
Presenter: Alan Weber, Cimetrix
View Abstract

[MT-P-29] High Efficiency Driving of Nonresonant Ultarasonic Motor
Presenter: Yuki Soh, Kumamoto University
View Abstract

[ISSM-01] End Point Detection on the Time Series Process Data
Presenter: Nobuichi Kuramochi, Toshiba

[ISSM-02] Framework for Wafer Level Control APC Model
Presenter: Hiroomi Onda, Hitachi

[ISSM-03] Applying mashup technology to Semiconductor Manufacturing Executing System
Presenter: Tsuyoshi Itou, Yasuhiro Yoshihara, IBM

[ISSM-04] Digitized Service Contents for Process & Equipment Engineering
Presenter: Shigeru Kobayashi, Renesas Electronics