International Symposium on Semiconductor Manufacturing (ISSM)

ABOUT ISSM

ISSM HISTORY

ISSM's mission is to achieve the continued prosperity of the semiconductor industry by bringing about breakthroughs in semiconductor manufacturing technologies through networking between engineers in research and development fields and their counterparts in the manufacturing field.

2019 e-Manufacturing & Design Collaboration Symposium -A Joint Symposium with ISSM 2019
The Ambassador Hotel Hsin Chu, Taiwan
September 6, 2019.
2018 ISSM2018
KFC Hall, Tokyo Japan
December 10-11, 2018
2017 e-Manufacturing & Design Collaboration Symposium -A Joint Symposium with ISSM 2017
The Ambassador Hotel Hsin Chu, Taiwan
September 9, 2017
2016 ISSM 2016
KFC Hall, Tokyo Japan
December 12-13, 2016
2015 e-Manufacturing & Design Collaboration Symposium -A Joint Symposium with ISSM 2015
Taipei World Trade Center Nangang Exhibition Hall
September 2-3, 2015
2014 ISSM 2014
Hyatt Regency Tokyo, Tokyo, Japan
December 2-3, 2014
2013 e-Manufacturing & Design Collaboration Symposium -A Joint Symposium with ISSM 2013
The Ambassador Hotel Hsin Chu, Taiwan
2012 ISSM 2012
Hyatt Regency Tokyo, Tokyo, Japan
October 15-17, 2012
2011 e-Manufacturing & Design Collaboration Symposium -A Joint Symposium with ISSM 2011
The Ambassador Hotel Hsin Chu, Taiwan
September 5-6, 2011
2010 ISSM2010
Hyatt Regency Tokyo, Tokyo, Japan
October 18-20, 2010
2008 ISSM2008
Hyatt Regency Tokyo, Tokyo, Japan
October 18-20, 2010
2007 ISSM2007
Marriott Hotel, Santa Clara, California USA
October 15-17, 2007
2006 ISSM 2006
Hyatt Regency Tokyo, Tokyo, Japan
September 25-27, 2006
2005 ISSM2005
Fairmont Hotel, San Jose, California, USA
September 13-15, 2005
2004 ISSM2004
Keio Plaza Hotel, Tokyo, Japan
September 27-29, 2004
2003 ISSM2003
San Jose, California, USA
September 30 - October 2, 2003
2002 ISSM2002
October 15-17,2002
Japan
2001 ISSM2001
SanJose,California, USA
October 8-10, 2001
2000 ISSM2000
September 26-28, 2000
Toshi Center Hotel, Tokyo, Japan
Zenkoku Toshi Kaikan, Tokyo, Japan
1998 ISSM1998
Hotel East 21 Tokyo, Tokyo, Japan
October 7-9, 1998
1996 ISSM1996
Hotel East 21 Tokyo, Tokyo, Japan
October 2-4, 1996
1995 ISSM1995
Austin, Texas, USA
September 17-19, 1995
1994 ISSM1994
TOSHO HALL
June 21-22, 1994
1993 Austin, Texas, USA
September 20-21, 1993
1992 ISSM1992
The Hotel New Otani, Tokyo, Japan
May 14-15, 1992

ISSM BACKGROUND

The semiconductor industry has brought about a dramatic transformation to society in the half century since the invention of the transistor. In much the same way as the revolution that brought transistors to integrated circuits, the system LSI is a concept that will bring a paradigm shift that will impact across the global semiconductor, IT and electronics related industries. With the advent of the system LSI, in addition to the importance of scaling rules based technology development, it is now essential to establish a new scheme for semiconductor manufacturing technologies in order to meet requirements for system LSIs as technologies for a ubiquitous network society.

The semiconductor industry is going through a big transition to meet this change. As an industry heavily dependent on its manufacturing capability and productivity, the industry is shifting from an integrated device manufacturing model to more horizontal specialized manufacturing processes, as well as pursuing manufacturing cost reductions with 300mm wafer transition, a step-by-step investment approach, and the introduction of customized, small/medium quantity production methods. The key words for competitive SoC manufacturing technologies are high quality, low cost, and high efficiency. Furthermore, environmental considerations are also becoming an important consideration for semiconductor manufacturing processes.

Semiconductor manufacturing technology is reliant on the sum of the total of engineers' experiences and the accumulation of know-how and IP. The complexity of the field prevents a shift to the systematization and universalization of technologies. In order to bring breakthroughs in semiconductor manufacturing to reflect changing and challenging new requirements, the International Symposium on Semiconductor Manufacturing (ISSM) was launched in 1992.

ISSM is an annual conference of semiconductor manufacturing professionals dedicated to sharing technical solutions and opinions on the advancement of manufacturing science, technologies, and management disciplines. ISSM aims to establish new concepts for semiconductor manufacturing technologies and to promote them as systemized and universalized technologies. ISSM's role has been to challenge the concept of shifting from "know-how" to "science" in semiconductor manufacturing technologies. The past twelve annual symposia have helped to shape the course of development of "manufacturing science," as well as to create new manufacturing technologies.

The Symposium is held under the joint sponsorship of the Society of Applied Physics of Japan, the IEEE Electron Devices Society, Semiconductor Equipment and Materials International (SEMI), and Taiwan Semiconductor Industry Association (TSIA). ISSM, with its global range, continuously pushes technological development in order to promote the discovery and utilization of innovative technologies.

ISSM's mission is to achieve the continued prosperity of the semiconductor industry by bringing about breakthroughs in semiconductor manufacturing technologies through networking between engineers in research and development fields and their counterparts in the manufacturing field.

ISSM Sponsors

Co Sponsored by: IEEE Electron Devices Society, Minimal Fab
Co Sponsored by: IEEE Electron Devices Society, Minimal Fab

ISSM Supporters

Supported by Semiconductor Equipment Association of Japan (SEAJ),Semiconductor Equipment and Materials International (SEMI) and Taiwan Semiconductor Industry Association (TSIA)
Supported by Semiconductor Equipment Association of Japan (SEAJ),Semiconductor Equipment and Materials International (SEMI) and Taiwan Semiconductor Industry Association (TSIA)

Endorsement by The Japan Institute of Electronics Packaging, The Japan Society of Applied Physics
Endorsement by The Japan Institute of Electronics Packaging, The Japan Society of Applied Physics

Contact to issm issm_2020@semiconportal.com for further inquiries.