PROGRAM SCHEDULE
This program schedule is in JST (Japan Standard Time)
ISSM2020 Program Schedule at-a-glance(as of Dec 11th)
Tuesday, December 15
Tues, Dec 15 | Wed, Dec 16
Plenary Session
| 8:50 | Opening Opening Remarks by Mr. Shozo Saito, Device & System Platform Development Center, ISSM Organiging Committee Chair ISSM2020 by Dr. Ayako Shimazaki, Toshiba Nanoanalysis Corporation, ISSM Executive Committee Chair Program Outline by Dr. Shin-ichi Imai, Hitachi High-Tech Solutions Corporation, ISSM Program Committee Chair |
| 9:10 |
Tutorial Speech 1 (in Japanese) Ultra Clean Technology Concept and Results Dr. Yasuyuki Shirai, Tohoku University |
| 9:50 | Break |
| 9:55 |
Tutorial Speech 2 (in Japanese) Plasma process-induced damage-modeling and characterizations Dr. Koji Eriguchi, Kyoto University |
| 10:35 | Break |
| 10:45 |
Keynote Speech 1 NVIDIA AI EVOLUTION Masataka Osaki, NVIDIA Japan |
| 11:25 | Break |
| 11:30 |
Keynote Speech 2 New Smart-Microsystems Age Enabled by Heterogeneous Integration of Silicon-Centric and AI Technologies - My Personal View Dr. Nicky Lu, Etron |
| 12:10 | Lunch Break (Exhibitor Presentation) |
| 12:50 |
EDTM2020-INVITED High Volume Semiconductor Manufacturing Using Nanoimprint Lithography Kazuki Nakagawa / Yukio Takabayashi, Canon |
| 13:10 | Break |
RoomA
Session A-1:
Process/Material Optimization (PO)-1
| 13:20 |
PO-47 : Ar/N2-Plasma Sputtering Pressure Dependence on EOT Reduction of HfON Tunneling layer Formed by The Plasma Oxidation of HfN for Hf-based MONOS Diodes Jooyoung Pyo, Tokyo Institute of Technology |
| 13:40 |
PO-48 : Investigation of high-k HfN multilayer gate dielectrics for MISFET fabricated with Si surface flattening Akio Ihara, Tokyo Institute of Technology |
| 14:00 |
PO-25 : Etching characteristics of PECVD prepared SiN films with CF4/H2 and CF4/D2 plasmas at different substrate temperatures Shih-Nan Hsiao, Nagoya University |
| 14:20 | Author's Interview & Break |
Session A-2:
Process/Material Optimization (PO)-2 & Process Monitoring & Control Method (PM)-1
| 14:40 |
PO-37 : Study on Measurement Method of Microscopic ζ Potential Yuichi Watanabe, FUJIMI INCORPORATED |
| 15:00 |
PO-39 : Process Optimization of Trench Field Plate Power MOSFETs with Sequential Phosphorus-Doped Silicon Kota Tomita, TOSHIBA DEVICE & STORAGE |
| 15:20 |
PM-19 : Quality Control of Trench Field Plate Power MOSFETs by Correlation of Trench Angle and Wafer Warpage Hiroaki Kato, TOSHIBA DEVICE & STORAGE |
| 15:40 |
PM-07 : Feature Extraction from Equipment Sensor Signals with Time Series Clustering and Its Application to Defect Prediction Daisuke Hamaguchi, Sony Semiconductor Manufacturing |
| 16:00 | Author's Interview & Break |
Session A-3:
Process Monitoring & Control Method (PM)-2 & Ultraclean Technology (UT)
| 16:20 |
PM-08 : Quality-Oriented Statistical Process Control Utilizing Bayesian Modeling Kaito Date, Kioxia |
| 16:40 |
PM-24 : Highly Accurate Quality Prediction for High-Mix Low-Volume Semiconductor Products using Hierarchical Bayes Model Kosuke Okusa, Yokohama City University |
| 17:00 |
PM-18 : Using Quartz Crystal Microbalance to Provide Real-Time Process Monitoring Hirofumi Tsuchiyama, INFICON |
| 17:20 |
UT-10 : Study on ultra-trace metal analysis in organic solvent by re-dissolved method and direct method Hiromi Kimura, Kurita Analysis Service Co. Ltd. |
| 17:40 | Author's Interview & Break |
| 18:00 | Break |
| 18:10 | Networking |
| 19:00 |
RoomB
Session B-1:
Worker and WIP Control (WC) & Manufacturing Strategy (MS)
| 13:20 |
WC-51 : Optimization of multi-objective function of Hybrid Flowshop Scheduling-Batch Process with Q-time Jia LIN, University of Tsukuba |
| 13:40 |
MS-21 : A Study of the CMOS Image Sensor Semiconductor Business: Factors Maintaining the Long-Term Manufacturing Technology Superiority of IDM Companies Tetsuya Asami, Tokyo Institute of Technology |
| 14:00 |
MS-16 : Digital Transformation’s Impact on Smart Manufacturing John Behnke, INFICON |
| 14:20 | Author's Interview & Break |
Session B-2:
Intelligent Data Management (ID)-1 & Material Informatics (MI) & New Gas, New Liquid, and New Resist Technologies (NM)
| 14:40 |
ID-22 : Ageing Monitoring of GaN Transistors using Recurrent Neural Networks Florian Chalvin, Rohm Semiconductor |
| 15:00 |
ID-38 : CMP Process Optimization Engineering by Machine Learning Hsiang-Meng Yu, Macronix International |
| 15:20 |
MI-36 : Predicting and considering properties of general polymers using incomplete dataset Hitoshi Yamano, Tokyo Ohka Kogyo Co., Ltd. |
| 15:40 |
NM-42 : Recent Progress on Spin-on Inorganic Materials Kazunori Sakai, JSR Corporation |
| 16:00 | Author's Interview & Break |
Session B-3:
Yield & Defect Control (YD)-1
| 16:20 |
YD-29 : Reduction of harmful effect due to by-product in CVD reactor for 4H-SiC epitaxy Yoshiaki Daigo, NuFlare Technology, Inc. |
| 16:40 |
YD-30 : Impact of precise temperature control for 4H-SiC epitaxy on large diameter wafers Yoshiaki Daigo, NuFlare Technology, Inc. |
| 17:00 |
YD-33 : Improvement of Multi-lines Bridge Defect Classification by Hierarchical Architecture in Artificial Intelligence Automatic Defect Classification Bing-Sheng, Lin, Macronix International |
| 17:20 |
YD-23 : Minimization of CNN Training Data by using Data Augmentation for Inline Defect Classification Akihiro Fujishiro, Renesas Electronics |
| 17:40 | Author's Interview & Break |
| 18:00 | Break |
| 18:10 | Networking |
| 19:00 |
Wednesday, December 16
Tue, Dec 15 | Wed, Dec 16
Plenary Session
| 8:50 |
Keynote Speech 3 Novel sensors from CREST project and open innovation platform, Leafony, connecting sensors to IoT/AI applications (tentative) Prof. Takayasu Sakurai, The Univ. of Tokyo |
| 9:30 | Break |
| 9:40 |
Keynote Speech 4 Rapid Yield Improvement Using Intelligent Data Mining Dr.Vivek Jain, Maxim Integrated |
| 10:20 | Break |
| 10:25 |
Keynote Speech 5 Current status and prospective of all-solid-lithium ion batteries Prof. Takeshi Abe, Kyoto University |
| 11:05 | Break |
| 11:10 |
Keynote Speech 6 The outlook of semiconductor industry market in New Normal Age and the impact of US-China on semiconductor supply chain Akira Minamikawa, Omdia |
| 11:50 | Lunch Break (Exhibitor Presentation) |
| 12:30 |
AI Contest Manufacturing Fab Data AI utilization Idea Contest
* SEM Image Classification AI Algorithm Contest * Semiconductor Manufacturing Fab Data AI utilization IdeaContest |
| 13:30 | Break |
| 13:40 |
Keynote Speech 7 SiC and GaN devices for improved power efficiency in automotive and industrial applications Dr. Salvatore Coffa, ST Microelctronics |
| 14:20 | Break |
RoomA
Session A-4:
Process Monitoring & Control Method (PM)-3
| 14:30 |
PM-46 : Chamber and Recipe-Independent FDC indicator in High-mix Semiconductor Manufacturing Satoshi Yasuda, Tower Partners Semiconductor |
| 14:50 |
PM-09 : Anomaly detection and analysis by a gradient boosting trees and neural network ensemble model Takayuki Nishimura, Sony Semiconductor Manufacturing |
| 15:10 |
PM-31 : AI-FDC: Automated Top Down System for Fab Wide Process Equipment Health Monitoring Michael Keleher / Richard Burch, PDF Solutions |
| 15:30 |
PM-35 : FDC Based on Neural Network with Harmonic Sensor to Prevent Error of Robot Kenta Kamizono, Panasonic |
| 15:50 | Author's Interview & Break |
Session A-5:
Process Monitoring & Control Method (PM)-4 & Intelligent Data Management (ID)-2
| 16:10 |
PM-13 : The Benefits of Real time Cloud Analytics in Semiconductor Gabe Villareal, BISTel |
| 16:30 |
PM-44 : Planned Maintenance Schedule Update Method for Predictive Maintenance of Semiconductor Plasma Etcher Shota Umeda, Hitachi, Ltd. |
| 16:50 |
PM-43 : Seasoning Optimization by using Optical Emission Spectroscopy Masahiro Shiga, Tokyo Electron |
| 17:10 |
ID-45 : Analysis of Visualized Complex Reaction Network in Low-Temperature Molecular Plasma Osamu Sakai, The University of Shiga Prefecture |
| 17:30 | Author's Interview & Break |
| 17:50 | Award & Networking |
RoomB
Session B-4:
Yield & Defect Control (YD)-2
| 14:30 |
YD-14 : Taking Engineering Automation to the Next Level with Artificial Intelligence Peter Barar / Kim Kok Gan, BISTel |
| 14:50 |
YD-41 : Rapid Resolution of Parametric Failures in the Process Development Period by Integrating Device Physics and Big Data Takahiko Hashidzume, Tower Partners Semiconductor |
| 15:10 |
YD-17 : Smart Integrated Metrology Sampling Hirofumi Tsuchiyama, INFICON |
| 15:30 | |
| 15:50 | Author's Interview & Break |
Session B-5:Final Manufacturing & Integrated Package (FM)
| 16:10 |
FM-50 : Ni Difusion Behavior and Bondability of Electroless NiP/PdP/Au Film Akifumi Kurachi, JX Nippon Mining & Metals Corporation |
| 16:30 |
FM-32 : AlN filler for high thermal conductive resin materials Yoshitaka Inaki, Tokuyama corporation |
| 16:50 |
FM-40 : Reliability and High-Frequency Filter Characteristics of Low-Loss Materials for 5G RF Modules Takenori Kakutani, Taiyo Ink Mfg. Co., Ltd. |
| 17:10 |
FM-11 : High-Throughput Direct Adaptive Imaging System with Novel Measurement Tool for Heterogeneous Integration Shota Majima, SCREEN Semiconductor Solutions |
| 17:30 | Author's Interview & Break |
| 17:50 | Award & Networking |