ISSM AI Solution Contests
ISSM Semiconductor Manufacturing Fab Data AI utilization Idea Contest
The solution ideas applying AI for the huge amount of data accumulated at the semiconductor manufacturing fabs are expected at this contest. For example, how to stabilize the yield of semiconductor chips, reduce factory costs, and increase profits, how to remotely manufacture semiconductor chips in consideration of with and after COVID-19, etc.
Entry
Entry has been closed
Requirement
- Qualification: Students (Both individuals and teams can participate)
- Evaluation: ISSM Program Committee will review the proposal of solution ideas applying AI for the challenges related to big data accumulated in semiconductor manufacturing fabs. The originality and feasibility will be reviewed.
The applications that have passed the preliminary selection will be publicized at ISSM conference period and evaluated based on the number of "like" points by ISSM2020 participants. The top three will be awarded. - Submission: The applicants are required to submit video presentation in mp4 up to 5-minute to ISSM secretariat. Embed video, audio, and subtitles are allowed. Use the contest template (PowerPoint). The first page covers presentation title, name of author(s) or team, and selected category (see table below).
Category for ISSM Semiconductor Manufacturing Fab Data AI utilization Idea Contest
Submission
Upload to the following Drop Box.
You are required to the required files (MP4 & PPT ) into a Zip file.
The file Name must have your team name.
eg. Team-ISSM. zip
ISSM Semiconductor Manufacturing Fab Data AI utilization Idea Contest Drop Box
Schedule (The deadline has been extended)
- Entry due date: November 13, 2020
- Video due date: December 4, 2020
Award and Award Examination Guidelines
Award: The best three applicants passed the final selection based on the number of “like” points by ISSM 2020 participants will be recognized at the Award Ceremony during ISSM 2020 conference period (December 15-16, 2020).