セミコンポータル

半導体・FPD・液晶・製造装置・材料・設計のポータルサイト

Global SemiConsortium

Global SemiConsortium
Holst Centre:
オランダのTNO(応用科学研究機構)とベルギーのIMECが共同で設立した研究所。フィリップス社の研究センターの跡地に設置。
IME(Institute of Microelectronics):
シンガポールの半導体研究所。LSIプロセスから実装(3D IC)に至るまで、SiだけではなくGaNやSiCについても研究している。
IMEC(Interuniversity Microelectronics Centre):
ベルギーにある半導体技術の研究所。世界中から人材が集まり、半導体の設計、製造、応用などについて研究する。
LETI(Laboratoire d'Electronique des Technologies de I'information):
フランスの科学技術庁CEAの中にある電子情報技術研究所。STMicroelectronicsなどと密に活動している。MEMS技術は定評がある。
NMI(National Microelectronics Institute):
英国の半導体企業が集まる非営利の業界団体。
UAlbany:
米ニューヨーク州立大学アルバニー校。半導体製造に力を入れ、世界の半導体研究の拠点の一つになっている。ニューヨーク州が熱心に資金提供。
SRC(Semiconductor Research Corp):
米国の半導体研究を推進する大学のコンソーシアム。
SEMATECH(Semiconductor Manufacturing Technology):
半導体プロセスの研究開発を行う米国のコンソーシアム。

2018/4/17
Ualbany: SUNY Poly research published in Journal of Microscopy
2018/4/17
Imec: ESPResSo, an Ambitious EU Funded Collaboration to Make Perovskite Solar Cells a Market Reality
2018/4/10
Imec reaches milestone for next-gen solid-state batteries to power future long-range electrical vehicles
2018/4/6
Imec and Qromis Present High Performance p-GaN HEMTs on 200mm CTE-matched Substrates
2018/4/5
Leti Silicon Photonics Design Kit Available For Synopsys OptoDesigner Pic Design Solution

2018/3/26
Leti: Pixcurve reduces camera size by half
2018/3/20
Leti: CEA Shows Path to Creating Building Blocks of Quantum Processors With 28si Isotope In a CMOS Fab Line
2018/3/15
Ualbany: Semiconductor Today: AIM Photonics detailing opportunities for integrated photonics-related partnerships at OFC
2018/3/7
Ualbany: AIM Photonics News Release: AIM Photonics To Detail Opportunities for Integrated Photonics-Related Partnerships During OFC 2018-the Optical Networking and Communication Conference & Exhibition
2018/3/6
Ualbany: SUNY Poly's Center for Semiconductor Research in Albany Earns World-Class TÜV SÜD AMERICA INC. ISO 9001:2015 Certification
2018/3/5
Leti: Electron holography delivers atomic resolution, providing new insights into material structures

2018/2/28
Imec and Cadence Tape Out Industry’s First 3nm Test Chip
2018/2/26
Ualbany: Manufacturing USA: New Video: AIM Photonics Powering the 21st Century with Integrated Photonics
2018/2/23
Ualbany: CDRInfo: IBM Researchers Talk About the Future of EUV, Research at SUNY Poly at SPIE
2018/2/23
Imec Pushes the Limits of EUV Lithography Single Exposure for Logic N5 Metal Layers and Dense DRAM Applications
2018/2/21
Leti & Mapper will Present 3 Papers on Massively Parallel Electron-Beam Litho at SPIE Advanced Lithography 2018
2018/2/20
Leti: Shorter time-to-market for CPS-based solutions
2018/2/15
Leti: EU-South Korean Project Will Demonstrate 5G System Prototype at 2018 Winter Games
2018/2/14
Leti: Close to the Edge: Brain-Inspired Technologies Will Bring Data Processing and Analytics to IoT Devices
2018/2/12
Imec Presents Together with Renesas Electronics an Ultra-Low Power Transceiver for Bluetooth 5 and Beyond with Lowest Supply Voltage Ever Reported
2018/2/12
Imec Introduces CMOS Chip With 16,384 Micro-electrodes and 1,024 Channels for Multimodal Cell Interfacing
2018/2/5
Holst Centre: Henkel and Holst Centre continue collaboration
2018/2/2
Leti Proposes Curving Technology For Optical Equipment That Improves Performance And Reduces Cost And Size

2018/1/29
Imec’s high-speed ultrasonic SNAPSCAN camera enables hyperspectral imaging acquisition in less than one second
2018/1/25
Imec demonstrates Shortwave Infrared (SWIR) range hyperspectral imaging camera
2018/1/18
Leti To Demonstrate New Curving Technology That Improves Performance Of Optical Components @ Photonics West
2018/1/18
SRC: Beyond 5G: UCSB is the lead institution for a research center that will explore terahertz-range communications and sensing
2018/1/16
Leti: Fingerprints under the microscope
2018/1/16
SRC: New C-BRIC center will tackle brain-inspired computing
2018/1/9
Imec's SWEET study collects world's largest dataset on stress detection
2018/1/9
Imec and Holst Centre introduce EEG Headset for emotion detection

2017/12/21
SRC: Steering electrical current with spinning light
2017/12/18
Leti and CloudNet IT-Solutions Demonstrate New Multicarrier Waveform for Rural and Maritime Broadband Radio
2017/12/14
Leti to Demonstrate First 3D Anti-crash Solution for Embedding in Drones @CES2018
2017/12/8
Leti recently miniaturized a key component for the testing and measurement market
2017/12/6
Leti Integrates Hybrid iii-v Silicon Lasers On 200mm Wafers Using Standard CMOS Process
2017/12/6
Leti Memory Breakthroughs Point Way To Significant Improvements In System-on-Chip Memories
2017/12/4
Imec Achieves Record Low Contact Resistivity on Ga-doped Ge Source/Drain Contacts for pMOS Transistors
2017/12/4
Imec Demonstrates Power-Performance-Area-Cost Benefit of Heterogeneous Sequential-3D Integration for Advanced CMOS Nodes
2017/12/4
Imec Demonstrates for the First Time Functional Ring Oscillators Based on Stacked Gate-all-Around Silicon Nanowire Transistors

2017/11/16
Leti: Silicon photonics for high-performance computing
2017/11/15
Holst Centre: (Not) breaking the barrier to foldable OLED displays
2017/11/14
Imec expands strategic partnership with Western Digital
2017/11/14
Leti Announces FED4SAE Project to Accelerate European Cyber-Physical-System Solutions to Market
2017/11/13
Imec and Panasonic introduce innovative nanocomposite electrolyte for next-generation batteries
2017/11/13
Leti Demonstrates World’s First 300-mm Wafer-to-Wafer Direct Hybrid Bonding With 1-micron Pitch on EV Group System
2017/11/8
IME: A*STAR IME's New Multi-Chip Fan-Out Wafer Level Packaging Development Line to drive Innovation and Growth in Semiconductor Industry

2017/10/30
Imec partners in European initiative to develop Organs-on-Chip
2017/10/17
Holst Centre, imec and Philips demo world's first curved, plastic photodetector
2017/10/11
Imec and Analog Devices sign strategic research partnership for development of next-generation IoT devices
2017/10/10
Leti: ISKN, the first B-to-C startup to be spun off by CEA Tech institute Leti, has done very well, with selling more than 3,000 units of its flagship Slate through several distribution channels.
2017/10/4
SRC: Samsung Electronics Joins SRC
2017/10/3
Imec Leverages the Power of Silicon Fabrication to Create Innovative Neural Probe Demonstrator with Unprecedented Electrode Density
2017/10/3
Imec Reports Micro-Optomechanical Pressure Sensor Advancing Pressure Monitoring in Biomedical Applications

2017/9/28
Leti: A GaN microdisplay with incredible resolution
2017/9/20
Holst Centre: CPT and imec / Holst Centre Demonstrate 1250 ppi, FMM-free Multicolor OLED Displays with Photolithography
2017/9/20
Imec: CPT and imec / Holst Centre Demonstrate 1250 ppi, FMM-free Multicolor OLED Displays with Photolithography
2017/9/19
Leti Develops Proof Of Concept To Test Wireless Systems In Aircraft
2017/9/19
SRC: Samsung Electronics Company Joins SRC
2017/9/11
Leti: Semiconductor industry backs SigmaFusion for automotive applications
2017/9/6
Imec Reports World-Class Low-Power IP Blocks for 5G
2017/9/5
Leti and Partners in PiezoMAT Project Develop New Fingerprint Technology For Highly Reliable Security and ID Applications

2017/8/31
Leti: Terabee maps enclosed spaces in real time
2017/8/31
Leti Launches Emulator Service to Boost Roi and Speed Time to Market For European Chipmakers
2017/8/24
NMI: Moortec announce their Embedded In-Chip Monitoring Subsystem on TSMC 7FF
2017/8/8
Imec Reports Record Conversion Efficiency of 23.9 Percent on a 4cm2 Perovskite/Silicon Solar Module

2017/7/26
NMI Yearbook 2017 is now online
2017/7/24
SRC: UCLA-led research offers clearest evidence yet of long-sought Majorana particle
2017/7/13
Leti: PLAT4M Matures Three Silicon Photonic Platforms
2017/7/12
Ualbany: AIM Photonics Welcomes Mentor as Newest Tier 1 Member
2017/7/10
Imec demonstrates Electrically Functional 5nm Solution for Back-End-of-Line
2017/7/10
Imec and Partners Uncover Path to Unlock 2D Materials-Based Field-Effect Transistors (FETs) for High Performance Logic
2017/7/5
SRC: New 3-D chip combines computing and data storage
2017/7/4
Leti: IPRASENSE launches “Cytonote High Throughput Cell Counter”, its 3rd product leveraging Leti’s lens-free technology

2017/6/28
Leti and Fraunhofer Team Up To Strengthen Microelectronics Innovation In France And Germany
2017/6/20
Leti Sigmafusion Solution for Autonomous Vehicles Embedded in Aurix Platform of Infineon
2017/6/13
IME: ROHM and A*STAR's IME to Develop Artificial Intelligence Chip for Predictive Maintenance in Smart Factories
2017/6/13
Imec World-First to Develop 200V and 650V dispersion free normally-off/e-mode Power Devices on 200mm/8-inch Si Wafers
2017/6/13
Leti announces two new tools for improving transportation comfort, safety and efficiency
2017/6/8
Imec demonstrates for the first time sub-10nm germanium gate-all-around devices
2017/6/8
Imec Achieves Record-Low Source/Drain Contact Resistivity for PMOS Transistors
2017/6/7
Imec demonstrates breakthrough in CMOS-compatible Ferroelectric Memory
2017/6/6
Imec: First-time Demonstration of a Plastic 12-bit RFID Tag and Read-out System with Screen-Printed Antenna

2017/5/30
Imec Presents Highly Accurate Model for Energy Yield Prediction of Photovoltaic Modules
2017/5/24
Imec and Cascade Microtech Develop First Automatic Probe System for Advanced 3D Chips
2017/5/18
Leti: Preventing thermal runaway in embedded batteries
2017/5/16
Holst Centre: Imec and Holst Centre Present Solution for Precise Low-Cost Eye Movement Detection
2017/5/16
Imec demonstrates self-learning neuromorphic chip that composes music
2017/5/16
Imec Introduces World’s First Thin-Silicon Implantable Chip for High-Precision Haptic Prosthetics
2017/5/16
Imec and Holst Centre Present Solution for Precise Low-Cost Eye Movement Detection
2017/5/10
Holst Centre wins IDTechEx Printed Electronics Europe 2017 Award for functional car console demonstrator using in-mold electronics technology
2017/5/4
Imec: One-man operated video capturing solution from AZilPix captures live events from all angles - in broadcast quality and at reduced cost

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