セミコンポータル

半導体・FPD・液晶・製造装置・材料・設計のポータルサイト

Global SemiConsortium

Global SemiConsortium
Holst Centre:
オランダのTNO(応用科学研究機構)とベルギーのIMECが共同で設立した研究所。フィリップス社の研究センターの跡地に設置。
IME(Institute of Microelectronics):
シンガポールの半導体研究所。LSIプロセスから実装(3D IC)に至るまで、SiだけではなくGaNやSiCについても研究している。
IMEC(Interuniversity Microelectronics Centre):
ベルギーにある半導体技術の研究所。世界中から人材が集まり、半導体の設計、製造、応用などについて研究する。
LETI(Laboratoire d'Electronique des Technologies de I'information):
フランスの科学技術庁CEAの中にある電子情報技術研究所。STMicroelectronicsなどと密に活動している。MEMS技術は定評がある。
NMI(National Microelectronics Institute):
英国の半導体企業が集まる非営利の業界団体。
UAlbany:
米ニューヨーク州立大学アルバニー校。半導体製造に力を入れ、世界の半導体研究の拠点の一つになっている。ニューヨーク州が熱心に資金提供。
SRC(Semiconductor Research Corp):
米国の半導体研究を推進する大学のコンソーシアム。
SEMATECH(Semiconductor Manufacturing Technology):
半導体プロセスの研究開発を行う米国のコンソーシアム。

2018/10/8
Leti: World-class SOI prototyping line
2018/10/4
Ualbany: AIM Photonics News Release: AIM Photonics is Unveiling Support for Datacom and Telecom Optical Bands with its New Silicon Photonics Process Design Kit (PDK)

2018/9/27
Imec: New Program to Kick-start US and Asian scale-ups in Europe
2018/9/24
Imec’s screen printed large-area nPERT solar cells surpass 23 percent efficiency
2018/9/24
Imec: Perovskite/CIGS tandem cell with Record Efficiency of 24.6 percent Paves the Way for Flexible Solar Cells and High-Efficiency Building-Integrated PV
2018/9/20
Home / Press releases / Imec Taiwan and ITRC-NARLabs to collaborate on advanced imaging and optics applications
2018/9/24
Leti: STMicroelectronics and Leti Develop GaN-on-Silicon Technology for Power Conversion Applications
2018/9/18
Leti & EFI Automotive Launch Project To Improve Reliability And Speed Of Low-Cost Electronic Devices For Autos
2018/9/13
Ualbany: Times Union: SUNY Poly research team trying to make chips more like human brain
2018/9/13
Leti Announces EU Project To Develop Powerful, Inexpensive Sensors With Photonic Integrated Circuits
2018/9/12
Imec.xpand raises EUR 117 million to invest in innovative, early-stage ideas leveraging imec’s knowledge, expertise and infrastructure
2018/9/7
Imec: UGent and imec launch fiber optic sensing spin-off Sentea
2018/9/4
Imec: Plannen voor nieuwe smart health & food samenwerking van wereldformaat in Gelderland
2018/9/4
Leti: Presentations PDF LID 2018
2018/9/4
Leti and VSORA Demonstrate 3GPP New Radio (5G NR) on Multi-Core Digital Signal Processor

2018/8/28
Leti: Microfluidics: standards to promote R&D
2018/8/2
Leti and CMP Announce World’s First Multi-Project Wafer Service with Integrated Silicon OxRAM

2018/7/24
Imec Beats Silicon PV with 27.1 Percent Perovskite-Silicon Tandem
2018/7/11
Leti and Oscaro Partner on Leti’s New Low-Power, Low-Cost Transceiver To Track Millions of Parcels
2018/7/10
Leti and Soitec Launch A New Substrate Innovation Center To Develop Engineered Substrate Solutions
2018/7/9
Imec and Soitec Demonstrate Sequential 3D Planar Device Achieving High-Reliability at Low Temperature
2018/7/9
Imec Demonstrates Hybrid FinFET-Silicon Photonics Technology for Ultra-Low Power Optical I/O
2018/7/9
Imec Reports Breakthrough in Extending Interconnects Beyond the 3nm Technology Node
2018/7/5
Leti, Transdev and IRT Nanoelec Announce Pilot Program To Assess New Perception Sensors For Autonomous Vehicles

2018/6/20
Imec Presents Complementary FET (CFET) as Scaling Contender for Nodes Beyond N3
2018/6/19
Imec furthers high-mobility nanowire FETs for nodes beyond 5nm
2018/6/18
Imec demonstrates manufacturability of state-of-the-art spin-orbit torque MRAM devices on 300mm Si wafers
2018/6/15
International Team Launches Microfluidics Group To Write Standards To Speed Device Development & Manufacturing
2018/6/7
Imec demonstrates compact low-power 140GHz CMOS radar with on-chip antennas
2018/6/4
Imec Extends Damascene Metallization Towards the 3nm Technology Node

2018/5/30
Imec demonstrates compatibility of state-of-the-art 0.8V-transceiver, with industry standard Arm Cordio IP for BLE 5
2018/5/29
Imec demonstrates efficient cost-effective cooling solution for high performance chips
2018/5/28
Imec Develops Industry-Compatible Screen-Printing Process for Highly Efficient n-PERT Solar Cells
2018/5/23
Imec Packs New Fast Eye Tracking Technology into Ergonomic Design for High-Quality AR/VR Experiences
2018/5/23
Imec and Unisantis Unveil Ultra-Scaled EUV-Enabled Surrounding Gate Transistor SRAM Cell
2018/5/22
Leti: Smart digital systems / Cybersecurity: chips individually marked by e-beam lithography
2018/5/16
Holst Centre: Flexible fingerprint sensors promise embedded secure access control
2018/5/14
Ualbany: SUNY Poly collaborative research published in APL Materials
2018/5/8
Ualbany: NYS Photonics Board of Officers Announces Tool Installation Work Begins at AIM Photonics TAP Facility in Rochester
2018/5/3
Leti & Cellmic LLC To Accelerate The Global Market Adoption Of Lens-Free Diagnostics And Biomedical Sensing
2018/5/2
Leti: Australian Prime Minister and French President announce plans for new quantum computing collaboration

2018/4/17
Ualbany: SUNY Poly research published in Journal of Microscopy
2018/4/17
Imec: ESPResSo, an Ambitious EU Funded Collaboration to Make Perovskite Solar Cells a Market Reality
2018/4/10
Imec reaches milestone for next-gen solid-state batteries to power future long-range electrical vehicles
2018/4/6
Imec and Qromis Present High Performance p-GaN HEMTs on 200mm CTE-matched Substrates
2018/4/5
Leti Silicon Photonics Design Kit Available For Synopsys OptoDesigner Pic Design Solution

2018/3/26
Leti: Pixcurve reduces camera size by half
2018/3/20
Leti: CEA Shows Path to Creating Building Blocks of Quantum Processors With 28si Isotope In a CMOS Fab Line
2018/3/15
Ualbany: Semiconductor Today: AIM Photonics detailing opportunities for integrated photonics-related partnerships at OFC
2018/3/7
Ualbany: AIM Photonics News Release: AIM Photonics To Detail Opportunities for Integrated Photonics-Related Partnerships During OFC 2018-the Optical Networking and Communication Conference & Exhibition
2018/3/6
Ualbany: SUNY Poly's Center for Semiconductor Research in Albany Earns World-Class TÜV SÜD AMERICA INC. ISO 9001:2015 Certification
2018/3/5
Leti: Electron holography delivers atomic resolution, providing new insights into material structures

2018/2/28
Imec and Cadence Tape Out Industry’s First 3nm Test Chip
2018/2/26
Ualbany: Manufacturing USA: New Video: AIM Photonics Powering the 21st Century with Integrated Photonics
2018/2/23
Ualbany: CDRInfo: IBM Researchers Talk About the Future of EUV, Research at SUNY Poly at SPIE
2018/2/23
Imec Pushes the Limits of EUV Lithography Single Exposure for Logic N5 Metal Layers and Dense DRAM Applications
2018/2/21
Leti & Mapper will Present 3 Papers on Massively Parallel Electron-Beam Litho at SPIE Advanced Lithography 2018
2018/2/20
Leti: Shorter time-to-market for CPS-based solutions
2018/2/15
Leti: EU-South Korean Project Will Demonstrate 5G System Prototype at 2018 Winter Games
2018/2/14
Leti: Close to the Edge: Brain-Inspired Technologies Will Bring Data Processing and Analytics to IoT Devices
2018/2/12
Imec Presents Together with Renesas Electronics an Ultra-Low Power Transceiver for Bluetooth 5 and Beyond with Lowest Supply Voltage Ever Reported
2018/2/12
Imec Introduces CMOS Chip With 16,384 Micro-electrodes and 1,024 Channels for Multimodal Cell Interfacing
2018/2/5
Holst Centre: Henkel and Holst Centre continue collaboration
2018/2/2
Leti Proposes Curving Technology For Optical Equipment That Improves Performance And Reduces Cost And Size

2018/1/29
Imec’s high-speed ultrasonic SNAPSCAN camera enables hyperspectral imaging acquisition in less than one second
2018/1/25
Imec demonstrates Shortwave Infrared (SWIR) range hyperspectral imaging camera
2018/1/18
Leti To Demonstrate New Curving Technology That Improves Performance Of Optical Components @ Photonics West
2018/1/18
SRC: Beyond 5G: UCSB is the lead institution for a research center that will explore terahertz-range communications and sensing
2018/1/16
Leti: Fingerprints under the microscope
2018/1/16
SRC: New C-BRIC center will tackle brain-inspired computing
2018/1/9
Imec's SWEET study collects world's largest dataset on stress detection
2018/1/9
Imec and Holst Centre introduce EEG Headset for emotion detection

2017/12/21
SRC: Steering electrical current with spinning light
2017/12/18
Leti and CloudNet IT-Solutions Demonstrate New Multicarrier Waveform for Rural and Maritime Broadband Radio
2017/12/14
Leti to Demonstrate First 3D Anti-crash Solution for Embedding in Drones @CES2018
2017/12/8
Leti recently miniaturized a key component for the testing and measurement market
2017/12/6
Leti Integrates Hybrid iii-v Silicon Lasers On 200mm Wafers Using Standard CMOS Process
2017/12/6
Leti Memory Breakthroughs Point Way To Significant Improvements In System-on-Chip Memories
2017/12/4
Imec Achieves Record Low Contact Resistivity on Ga-doped Ge Source/Drain Contacts for pMOS Transistors
2017/12/4
Imec Demonstrates Power-Performance-Area-Cost Benefit of Heterogeneous Sequential-3D Integration for Advanced CMOS Nodes
2017/12/4
Imec Demonstrates for the First Time Functional Ring Oscillators Based on Stacked Gate-all-Around Silicon Nanowire Transistors

2017/11/16
Leti: Silicon photonics for high-performance computing
2017/11/15
Holst Centre: (Not) breaking the barrier to foldable OLED displays
2017/11/14
Imec expands strategic partnership with Western Digital
2017/11/14
Leti Announces FED4SAE Project to Accelerate European Cyber-Physical-System Solutions to Market
2017/11/13
Imec and Panasonic introduce innovative nanocomposite electrolyte for next-generation batteries
2017/11/13
Leti Demonstrates World’s First 300-mm Wafer-to-Wafer Direct Hybrid Bonding With 1-micron Pitch on EV Group System
2017/11/8
IME: A*STAR IME's New Multi-Chip Fan-Out Wafer Level Packaging Development Line to drive Innovation and Growth in Semiconductor Industry

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