Global SemiConsortium

- Holst Centre:
- オランダのTNO(応用科学研究機構)とベルギーのIMECが共同で設立した研究所。フィリップス社の研究センターの跡地に設置。
- IME(Institute of Microelectronics):
- シンガポールの半導体研究所。LSIプロセスから実装(3D IC)に至るまで、SiだけではなくGaNやSiCについても研究している。
- IMEC(Interuniversity Microelectronics Centre):
- ベルギーにある半導体技術の研究所。世界中から人材が集まり、半導体の設計、製造、応用などについて研究する。
- LETI(Laboratoire d'Electronique des Technologies de I'information):
- フランスの科学技術庁CEAの中にある電子情報技術研究所。STMicroelectronicsなどと密に活動している。MEMS技術は定評がある。
- NMI(National Microelectronics Institute):
- 英国の半導体企業が集まる非営利の業界団体。
- UAlbany:
- 米ニューヨーク州立大学アルバニー校。半導体製造に力を入れ、世界の半導体研究の拠点の一つになっている。ニューヨーク州が熱心に資金提供。
- SRC(Semiconductor Research Corp):
- 米国の半導体研究を推進する大学のコンソーシアム。
- SEMATECH(Semiconductor Manufacturing Technology):
- 半導体プロセスの研究開発を行う米国のコンソーシアム。
- 2020/12/18
- CEA-Leti Scientists Present In-Memory Computing Pathways for Edge-AI & Neural Networks with 3D Architectures & Resistive-RAM
- 2020/12/17
- Imec presents smallest finFET-based biosensor for high-sensitivity molecule detection
- 2020/12/16
- Leti: Aledia Announces it Has Produced its First Nanowire Chips on 300mm Silicon Wafers Using CEA-Leti Pilot Lines
- 2020/12/15
- Imec Demonstrates Capacitor-less IGZO-Based DRAM Cell With >400s Retention Time
- 2020/12/15
- CEA to Enable High-Performance Processors That Will Power Exascale Computing
- 2020/12/9
- Imec Presents a Thin-Film Short-Wave-InfraRed Image Sensor with Sub-2µm Pixel Pitch
- 2020/12/3
- Imec Applies Photolithography To Push Functionality and Reliability Barriers In OLED Display Manufacturing
- 2020/11/26
- Imec and XIMEA launch industrial grade hyperspectral camera solution addressing the high-quality standards for machine vision applications
- 2020/11/18
- Imec: New imec research program pursues the development of scalable and energy-efficient 6G device technology
- 2020/10/29
- CEA-Leti to Build Quantum-Photonics Platform to Ensure Ultra-Secure Data for Finance, Energy, Defense and Other Industries
- 2020/10/28
- Holst Centre: Advanced interactive surfaces by TNO at Holst Centre: consoles and control panels re-invented
- 2020/10/27
- CEA-Leti Announces Collaboration with Intel to Advance Chip Design Through Cutting-Edge 3D Packaging Technologies
- 2020/10/23
- Imec begins developing SARS-CoV-2 test to identify positive cases and confirm whether someone is contagious in less than five minutes
- 2020/10/20
- Holst Centre: TNO at Holst Centre part of Madras project, a new European consortium
- 2020/10/13
- CEA Achieves Mass-Spectrometry Breakthrough that Paves the Way to Detecting Viruses
- 2020/10/9
- Imec presents alternative metals in advanced interconnect and contact schemes as a path to 2nm technology nodes
- 2020/10/3
- Leti: Light Communications Alliance formed by Global Industry Leaders
- 2020/10/3
- Leti and Partners in PiezoMAT Project Develop New Fingerprint Technology For Highly Reliable Security and ID Applications
- 2020/10/2
- NMI: The NMI Directory 20/21 is now available to download
- 2020/8/28
- Holst Centre: InSCOPE project boosts printed electronics past the research phase
- 2020/8/4
- Imec presents low-power 60 GHz radar chip for contactless health tracking in battery-powered devices
- 2020/7/22
- Imec: Five trends that will shape the future semiconductor technology landscape
- 2020/7/21
- Leti: HORIBA Medical and CEA-Leti to develop tomorrow’s diagnostics at the point of care.
- 2020/7/15
- Holst Centre’s near infrared vein detection sensor takes biometric security to a new level
- 2020/7/14
- Imec: University of Antwerp and imec launch Crowdscan, a new spin-off to measure crowds without compromising personal privacy
- 2020/7/8
- Imec and GLOBALFOUNDRIES Announce Breakthrough in AI Chip, Bringing Deep Neural Network Calculations to IoT Edge Devices
- 2020/7/1
- Leti: New consortium to develop a 5G and beyond strategic roadmap for future European connectivity systems and components
- 2020/6/24
- Holst Centre: The Province of Noord-Brabant, Economic Affairs & Climate Policy and TNO invest in Holst Centre’s new generation battery technology
- 2020/6/24
- IME: SingHealth and A*STAR co-developed smart chatbot to enhance care for COVID-19 patients at community care facilities
- 2020/6/23
- Imec: Deltaray enables zero-defect product manufacturing
- 2020/6/23
- Leti: EU Team Demonstrates Full Data-Transfer Silicon Photonics Module Delivering 100 Gb/s and Develops Building Blocks for Tb/s
- 2020/6/22
- CEA-Leti Scientists Demonstrate CMOS Device Fabrication at 500°C, Paving the Way to High-Performance 3D Monolithic CMOS Integration
- 2020/6/19
- Holst Centre creates method for effective production of electrolytes for solid-state batteries
- 2020/6/16
- Imec Overcomes Fundamental Operation Challenge for Voltage-Controlled Magnetic Random-Access Memories (RAM)
- 2020/6/15
- Imec Demonstrates Excellent Performance of Si FinFET CMOS devices with Integrated Tungsten Buried Power Rails
- 2020/6/15
- CEA-Leti Demonstrates Breakthrough Architecture for HPC Devices Using Gate-All-Around Nanosheet Fabrication Process
- 2020/6/11
- CEA-Leti Researchers Breakthrough put Record for LiFi Communications Using Single GaN Blue Micro-Light-Emitting Diode
- 2020/6/10
- NMI: Moortec Launches New In-Chip Technology
- 2020/6/9
- Holst Centre: Nederlandse uitvinding spatial Atomic Layer Deposition (sALD) van groot belang voor mondiale hightech industrie
- 2020/5/19
- Imec combines advanced machine learning algorithms and innovations in chip design to achieve cm accuracy and low-power ultra wideband localization
- 2020/5/13
- Imec: Lopos, a spin-off of imec and the Ghent University, presents the SafeDistance wearable that helps employees follow social distancing guidelines
- 2020/5/8
- Ualbany: SUNY Poly's Dr. Spyridon Galis' 'Engineered telecom emission and controlled positioning of Er3+ enabled by SiC nanophotonic structures' research published in Nanophotonics
- 2020/5/7
- CEA-Leti Explores Technology Roadmap For Sixth-Generation Wireless Networks in mmWave Bands
- 2020/5/5
- Imec: Roswell Biotechnologies and Imec to Develop First Molecular Electronics Biosensor Chips for Infectious Disease Surveillance, Precision Medicine and DNA Storage
- 2020/5/5
- Leti: A wireless detonation system designed to increase productivity and safety at open pit mines
- 2020/4/28
- Imec Builds World’s First Spiking Neural Network-Based Chip for Radar Signal Processing
- 2020/4/21
- Imec: European research institutes and industry partners join forces to develop high-performance solar panels with improved environmental profiles
- 2020/4/14
- SRC: Call for Research in Hardware Security
- 2020/4/3
- IME: SINGAPORE MARSHALLS R&D EFFORTS TO COMBAT COVID-19
- 2020/4/2
- Leti: Compact Model Developed at CEA-Leti for FD-SOI Technologies Designated as a Chip-Industry Standard
- 2020/4/2
- Ualbany: SUNY Poly Faculty and Staff Begin Manufacturing Personal Protective Equipment to Assist Front-Line Medical Workers
- 2020/3/31
- Leti: CEA sells its stake in Exagan
- 2020/3/26
- Imec: miDiagnostics Raises €14m to Accelerate the Commercialization of its Disruptive, Lab-quality Silicon Chip Diagnostics Platform
- 2020/3/20
- Leti: Highlights 2019
- 2020/3/9
- IME: Safer High-Performing Batteries with NanoBio Lab's 'Cupcake' Electrolyte
- 2020/3/9
- Leti: Startup Scintil Photonics ready to prototype
- 2020/3/4
- Imec and CST Global Collaborate to Extend Silicon Photonics Portfolio with Hybrid Integrated InP Light Sources
- 2020/3/3
- CEA-Leti Announces Smart-Farm Project to Lower Greenhouse Gas Emissions & Boost Farming Efficiency
- 2020/2/25
- Leti: NuVISION, the gamma camera that can multitask
- 2020/2/24
- Imec demonstrates 24nm pitch lines with single exposure EUV lithography on ASML’s NXE:3400B scanner
- 2020/2/21
- Leti: Optomechanical probe for very high speed sensing of atomic forces
- 2020/2/19
- First millimeter-scale wireless transceiver for electronic pills
- 2020/2/18
- CEA-Leti Is Demonstrating mmWave Communications for 5G Networks on MINATEC Campus
- 2020/2/18
- CEA-Leti and CEA-IRIG Demonstrate Quantum Integrated Circuit Combining Quantum Dot with Digital-Analog Circuits on CMOS Chi
- 2020/2/18
- CEA-Leti Presents High-Performance Processor Breakthrough With Active Interposer and 3D Stacked Chiplets at ISSCC 2020
- 2020/2/17
- A SiGe BiCMOS-based 100Gbaud Analog Time-Interleaver For Datacenters
- 2020/2/13
- IME: Boosting innovation in Digital Design and Advanced Manufacturing: Sembcorp Marine and A*STAR deepen R&D collaboration
- 2020/2/6
- Leti: Kalray, which completed its IPO last year, recently signed a distribution contract that will bring its intensive computing solutions for artificial intelligence to the rapidly-growing Chinese market.
- 2020/2/5
- CEA-Leti Clears a Path to Developing Ultralow Loss, High-Power Photonics in UV through Mid-Infrared Wavelengths
- 2020/2/3
- Imec: InSiDe, a European R&D project targeting mobile early-stage cardiovascular disease diagnosis and monitoring