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Global SemiConsortium

Global SemiConsortium

Holst Centre：: オランダのTNO（応用科学研究機構）とベルギーのIMECが共同で設立した研究所。フィリップス社の研究センターの跡地に設置。
IME（Institute of Microelectronics）：: シンガポールの半導体研究所。LSIプロセスから実装(3D IC)に至るまで、SiだけではなくGaNやSiCについても研究している。
IMEC（Interuniversity Microelectronics Centre）：: ベルギーにある半導体技術の研究所。世界中から人材が集まり、半導体の設計、製造、応用などについて研究する。
LETI（Laboratoire d'Electronique des Technologies de I'information）：: フランスの科学技術庁CEAの中にある電子情報技術研究所。STMicroelectronicsなどと密に活動している。MEMS技術は定評がある。
NMI（National Microelectronics Institute）：: 英国の半導体企業が集まる非営利の業界団体。
UAlbany：: 米ニューヨーク州立大学アルバニー校。半導体製造に力を入れ、世界の半導体研究の拠点の一つになっている。ニューヨーク州が熱心に資金提供。
SRC（Semiconductor Research Corp）：: 米国の半導体研究を推進する大学のコンソーシアム。
SEMATECH（Semiconductor Manufacturing Technology）：: 半導体プロセスの研究開発を行う米国のコンソーシアム。

2017/8/8: Imec Reports Record Conversion Efficiency of 23.9 Percent on a 4cm2 Perovskite/Silicon Solar Module

2017/7/26: NMI Yearbook 2017 is now online
2017/7/24: SRC: UCLA-led research offers clearest evidence yet of long-sought Majorana particle
2017/7/13: Leti: PLAT4M Matures Three Silicon Photonic Platforms
2017/7/12: Ualbany: AIM Photonics Welcomes Mentor as Newest Tier 1 Member
2017/7/10: Imec demonstrates Electrically Functional 5nm Solution for Back-End-of-Line
2017/7/10: Imec and Partners Uncover Path to Unlock 2D Materials-Based Field-Effect Transistors (FETs) for High Performance Logic
2017/7/5: SRC: New 3-D chip combines computing and data storage
2017/7/4: Leti: IPRASENSE launches “Cytonote High Throughput Cell Counter”, its 3rd product leveraging Leti’s lens-free technology

2017/6/28: Leti and Fraunhofer Team Up To Strengthen Microelectronics Innovation In France And Germany
2017/6/20: Leti Sigmafusion Solution for Autonomous Vehicles Embedded in Aurix Platform of Infineon
2017/6/13: IME: ROHM and A*STAR's IME to Develop Artificial Intelligence Chip for Predictive Maintenance in Smart Factories
2017/6/13: Imec World-First to Develop 200V and 650V dispersion free normally-off/e-mode Power Devices on 200mm/8-inch Si Wafers
2017/6/13: Leti announces two new tools for improving transportation comfort, safety and efficiency
2017/6/8: Imec demonstrates for the first time sub-10nm germanium gate-all-around devices
2017/6/8: Imec Achieves Record-Low Source/Drain Contact Resistivity for PMOS Transistors
2017/6/7: Imec demonstrates breakthrough in CMOS-compatible Ferroelectric Memory
2017/6/6: Imec: First-time Demonstration of a Plastic 12-bit RFID Tag and Read-out System with Screen-Printed Antenna

2017/5/30: Imec Presents Highly Accurate Model for Energy Yield Prediction of Photovoltaic Modules
2017/5/24: Imec and Cascade Microtech Develop First Automatic Probe System for Advanced 3D Chips
2017/5/18: Leti: Preventing thermal runaway in embedded batteries
2017/5/16: Holst Centre: Imec and Holst Centre Present Solution for Precise Low-Cost Eye Movement Detection
2017/5/16: Imec demonstrates self-learning neuromorphic chip that composes music
2017/5/16: Imec Introduces World’s First Thin-Silicon Implantable Chip for High-Precision Haptic Prosthetics
2017/5/16: Imec and Holst Centre Present Solution for Precise Low-Cost Eye Movement Detection
2017/5/10: Holst Centre wins IDTechEx Printed Electronics Europe 2017 Award for functional car console demonstrator using in-mold electronics technology
2017/5/4: Imec: One-man operated video capturing solution from AZilPix captures live events from all angles - in broadcast quality and at reduced cost

2017/4/26: Leti: New magnetic materials for 5G mobile networks
2017/4/19: Ualbany: AIM Photonics Announces IP Licensing Agreement with IBM; Welcomes IBM as newest Consortium Member
2017/4/19: NMI: Moortec and UltraSoc collaborate to enable next-generation “smart” PVT sensors
2017/4/18: Imec Develops Bifacial n-PERT Solar Cell with a Record 22.8 Percent Front-Side Efficiency
2017/4/11: Imec and Solliance’s perovskite PV modules achieve 12.4%
2017/4/5: Leti announces EU/South Korean project for world's first 5G-system prototype
2017/4/6: NMI Manufacturing Supplier Directory 2017 is now online

2017/3/30: Leti Marking 50 Years of Pioneering Innovation With Events and Workshops in France, Japan, Taiwan and the US
2017/3/29: Holst Centre demonstrates a smart shirt monitoring key vital signs for medical and fitness applications
2017/3/29: Imec: Audi Brussels Introduces Cobot Walt, a New Generation of Robot, in its Production Line
2017/3/27: Holst Centre and partners deliver functional surfaces for intuitive automotive and consumer user experiences
2017/3/23: Leti presented advances in propagation modeling and antenna design at EuCAP in Paris
2017/3/21: Imec demonstrates 896Gb/s silicon photonics transceiver
2017/3/14: Leti to release versatile SensiNact Internet of Things platform for open-source development
2017/3/10: SRC: C-SPIN Researchers Flip Magnetic Memory Cell with Light Pulse at Record Speed
2017/3/9: Holst Centre: Solliance and Holst Centre set world record for roll-to-roll produced perovskite-based solar cells with a stabilized efficiency of 12,6%
2017/3/8: Holst Centre: Imec and Holst Centre Present a Digital Receiver Excelling in Energy Efficiency and Small Size for Bluetooth 5 and Beyond
2017/3/8: Imec and Holst Centre Present a Digital Receiver Excelling in Energy Efficiency and Small Size for Bluetooth 5 and Beyond
2017/3/8: Leti announces backside shield that protects microchip from physical attacks
2017/3/7: Imec’s 200mm GaN-on-Si e-mode power devices withstand heavy ion and neutron irradiation
2017/3/6: Imec Presents InGaAs TFET with sub-60 mV/decade sub-threshold swing
2017/3/1: Imec and Besi Demonstrate Long-Term Reliability of Ni-Cu-Ag Plated Solar Modules

2017/2/28: SRC: TSMC Joins Semiconductor Research Corporation
2017/2/23: Holst Centre: DuPont Electronics and Communications and Holst Centre Extend Collaboration On Printed Electronics Research and Application Development
2017/2/22: LETI TO PRESENT LATEST R&D RESULTS ON THREE ALTERNATIVES TO EUV AND 193NM LITHOGRAPHY AT SPIE MEETING IN US
2017/2/9: Ualbany: New York Power Electronics Manufacturing Consortium Headquartered at SUNY Poly Announces Successful First Production of Silicon Carbide-Based Patterned Wafers
2017/2/8: Imec, Holst Centre and ROHM Present Breakthrough Solution for Ultra Low Power Internet of Things radios
2017/2/7: Holst Centre, imec and Cartamundi Introduce Plastic Near Field Communication Tag Communicating with Smartphones
2017/2/7: Imec, Holst Centre and Cartamundi Introduce Plastic Near Field Communication Tag Communicating with Smartphones

2017/1/30: Imec Introduces Snapscan: the First Hyperspectral Imaging Camera that Fuses the Benefits of Snapshot and Linescan technologies
2017/1/30: Imec demonstrates world's first multispectral time-delay-integration image sensor based on CCD-in-CMOS technology
2017/1/25: Imec: ENGIE and EnergyVille collaborate on future smart energy systems
2017/1/23: Imec Introduces New Snapshot Multispectral Image Sensor that Combines Color and Near-Infrared Imaging
2017/1/10: LETI TO DEMONSTRATE NEW MULTICARRIER WAVEFORM FOR 5G NETWORKS ON MINATEC CAMPUS
2017/1/3: Imec and Besi Demonstrate Long-Term Reliability of Ni-Cu-Ag Plated Solar Modules

2016/12/22: Imec Collaborates with Google to Offer Cloud Access to Flemish Startups
2016/12/15: Ualbany: Office of Governor Andrew M. Cuomo News Release: Governor Cuomo Announces Aim Photonics Manufacturing Facility to be Located in Rochester's Eastman Business Park at ON Semiconductor
2016/12/13: Holst Centre and imec Introduce World\'s First Solid-State Multi-Ion Sensor for Internet-of-Things Applications
2016/12/13: Imec and Holst Centre Introduce World’s First Solid-State Multi-Ion Sensor for Internet-of-Things Applications
2016/12/13: LETI TO DEMONSTRATE UNIVERSAL AFFORDABLE BIKE-PEDAL POWER METER AT CES
2016/12/13: AT CES 2017, LETI TO UNVEIL MOST ACCURATE WEARABLE DEVICE FOR CONSUMERS TO MEASURE RELAXATION
2016/12/13: LETI WILL DEMONSTRATE FUSION OF AUTONOMOUS CAR’S SENSES AT CES 2017
2016/12/9: Ualbany: U.S. Photovoltaic Manufacturing Consortium (PVMC) Announces Innovative Solar Energy Optimization Testkit to Provide Partners with Critical Data for Enabling Cost-Effective PV Technology Development and Deployment
2016/12/7: Imec Develops 3D-Compatible Germanium nMOS Gate stack with High Mobility and Superior Reliability
2016/12/6: Imec demonstrates record tunneling magnetoresistance for one of the world's smallest perpendicular magnetic tunnel junctions
2016/12/6: Imec Demonstrates World’s First Vertically Stacked Gate-all-Around Si Nanowire CMOS Transistors
2016/12/1: Leti: SCREEN SEMICONDUCTOR SOLUTIONS AND LETI EXPAND COLLABORATION TO COVER LASER ANNEAL TECHNOLOGY

2016/11/28: Leti: GRENOBLE TEAM DEMONSTRATES WORLD’S FIRST QUBIT DEVICE FABRICATED IN STANDARD CMOS PROCESS
2016/11/24: Holst Centre: Novel high-speed deposition process outperforms current techniques for making displays
2016/11/21: Leti Announces H2020 Project to Develop Si-photonics-based Transceivers for Low-cost, High-speed Data Communications
2016/11/15: Leti: KEEPING IT CLEAN: LETI JOINS FOUR FRENCH PARTNERS TO TEST ‘SMART’ ANTIBACTERIAL SURFACES IN SPACE
2016/11/9: Holst Centre: The first wearable daylight, sunlight and vitamin D coach in the world
2016/11/8: Holst Centre: Small, Energy-Efficient Health Patch from imec and Holst Centre Lays the Foundation for Better Mobile Health Solutions
2016/11/8: Imec: Small, Energy-Efficient Health Patch from imec and Holst Centre Lays the Foundation for Better Mobile Health Solutions
2016/11/3: Leti: ‘OWLY-EYED’: NEXT-GEN LOW-NOISE IMAGING TECHNOLOGY DEVELOPED BY LETI FOR FRENCH SME PYXALIS
2016/11/3: Leti: More computations for less energy - the European way

2016/10/31: Imec Reports Breakthrough Work that Advances Path for Nanoscale Spin-Wave Majority Gates
2016/10/13: Ualbany: Power Electronics Industry Collaborative News Release: SUNY Polytechnic Institute-Led NY Power Electronics Manufacturing Consortium and PEIC Announce Partnership to Strengthen U.S.-Based Power Electronics Industry
2016/10/10: Ualbany: SUNY Poly Receives $400,000 Worth of Cutting Edge Lab and Testing Equipment and Software from National Instruments
2016/10/4: Holst Centre: Imec and Holst Centre Present the World's Most Energy-Efficient Biomedical Sensor Hub for Wearable Health Applications
2016/10/4: Imecとホルストセンターが、ウェアラブル健康アプリケーションのための世界で最もエネルギー効率が高いバイオメディカルセンサーハブを発表
2016/10/4: LETI AND INSTITUTE FOR INFORMATION INDUSTRY OF TAIWAN PARTNER ON TECHNOLOGIES FOR INTERNET OF THINGS, 5G

2016/9/29: NMI: Innovative development hub to advance UK engineering
2016/9/27: Imec: Stacked Perovskite/CIGS Solar Module Achieves Unprecedented Efficiency at 17.8 Percent
2016/9/23: NMI’s AESIN Capability Directory 2016/17 is now online
2016/9/22: Holst Centre: OLED on ceramic heralds new possibilities for durable, flexible lighting and displays
2016/9/22: Imec: Merger between centers imec and iMinds completed
2016/9/21: LETI ORDERS HERCULES NIL SYSTEM FROM EV GROUP
2016/9/19: IME: Applied Materials and A*STAR's Institute of Microelectronics to Advance R&D in Fan-Out Wafer Level Packaging
2016/9/16: NMI: Evince secures £0.75 million of new investment for breakthrough diamond-based electronics
2016/9/13: Imec: ERC Starting Grant to revolutionize the efficiency, cost and stability of thin-film solar cells
2016/9/6: Leti: EU PROJECT TO PRESENT LATEST ON TECHNOLOGY AND ARCHITECTURE DEVELOPMENT FOR BRAIN-INSPIRED ICs
2016/9/1: Ualbany: AIM Photonics Welcomes PhoeniX Software as Newest Member of National Manufacturing Institute
2016/9/1: NMI: Moortec Announce Embedded Process Monitor on TSMC 16FF+

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