セミコンポータル

半導体・FPD・液晶・製造装置・材料・設計のポータルサイト

HOME » ニュース » Global SemiConsortium

Global SemiConsortium

Global SemiConsortium

Holst Centre：: オランダのTNO (応用科学研究機構)とベルギーのIMECが共同で設立した研究所。フィリップス社の研究センターの跡地に設置。
IME (Institute of Microelectronics)- A*STAR：: シンガポールの科学技術研究庁 (A*STAR)傘下にある半導体研究所。LSIプロセスから実装 (3D IC)に至るまで、SiだけではなくGaNやSiCについても研究している。
IMEC (Interuniversity Microelectronics Centre)：: ベルギーにある半導体技術の研究所。世界中から人材が集まり、半導体の設計、製造、応用などについて研究する。
ITRI (Industrial Technology Research Institute )：: 1973年に台湾で設立された研究開発機構。科学技術の研究開発により、産業発展と経済価値を創造し、社会福祉を促進することをミッションとする。
LETI (Laboratoire d'Electronique des Technologies de I'information)：: フランスの科学技術庁CEAの中にある電子情報技術研究所。STMicroelectronicsなどと密に活動している。MEMS技術は定評がある。
NMI (National Microelectronics Institute)：: 英国の半導体企業が集まる非営利の業界団体。
SRC (Semiconductor Research Corp)：: 米国の半導体研究を推進する大学のコンソーシアム。

2023/9/20: ITRI Leads Global Semiconductor Collaboration for Heterogeneous Integration to Pioneer Pilot Production Solutions
2023/9/12: ITRI Holds Envisioning a Better Future International Forum Featuring Global Industry Giants
2023/9/7: Holst Centre: Next-gen Equipment for Batteries and Battery materials
2023/9/5: IMEC: Axithra, a spin-off of imec and Ghent University, raises 10M Euro

2023/8/23: ITRI Joins HARTU Project to Drive European Industries towards Collaborative Manufacturing
2023/8/14: Imec integrates thin-film pinned photodiode into superior short-wave-infrared imaging sensors

2023/7/26: IME: A*STAR Leads R&D Programme With 10 Industry Partners To Develop High-performance Ev Component, And Boost Local EV Supplier Ecosystem
2023/7/20: IMEC: Enfoil, a new Hasselt University and imec spin-off, produces thin, flexible solar panels

2023/6/28: Imec and ASML sign Memorandum of Understanding (MoU) to support semiconductor research and sustainable innovation in Europe
2023/6/20: ITRI and EURECOM Sign an MoU on 6G Cooperation
2023/6/20: LETI: Concentrated competence in battery management: Vitesco Technologies France cooperates with CEA
2023/6/19: LETI: Extending Moore’s Law: CEA-Leti & Intel to Develop Atomically Thin 2D TMDs on 300mm Wafers Using Layer Transfer Technology for Future Transistor Scaling
2023/6/17: ITRI Set to Strengthen Taiwan-UK Collaboration on Semiconductors
2023/6/15: Holst Centre and Asahi Kasei demonstrate next-generation touchless user interface for displays
2023/6/12: IMEC: Advanced semiconductor packaging approach from AT&S and imec lays the foundation for compact, cost-efficient, and high-performance 140 GHz radar & 6G mobile communications systems
2023/6/9: Imec’s novel ultra-wideband transceiver combines best-ranging precision with record low power consumption
2023/6/2: CEA-Leti Proof of Concept Demonstrates Electrons Move Faster in Germanium Tin Than in Silicon or Germanium
2023/6/1: IME: Ross Digital and A*STAR Establish New Programme to Drive Innovation For the Food Services Industry

2023/5/24: NMI: The Latest NMI Directory is NOW AVAILABLE
2023/5/23: Imec first to demonstrate conductor films on 300mm wafers with lower resistivity than Cu and Ru
2023/5/19: NMI: Techworks acknowledges the governments publication of its long-awaited semiconductor strategy
2023/5/16: IMEC: GlobalFoundries, Samsung Electronics, and TSMC Join Imec’s “Sustainable Semiconductor Technologies & Systems” (SSTS) Program

2023/4/26: IME: Launching Networked Virtual Watch Tower Project for Supply Chain Performance
2023/4/25: IME: A*STAR Establishes Centre for Maritime Digitalisation With Flagship Research Programme to Deploy Ai Technologies in the Maritime Industry
2023/4/23: IME: Another Giant Leap Into Space: Successful Launch of Lumelite-4 to Enhance Maritime Communications
2023/4/20: NMI: BPC Electronics Invests in Wire Bonder to Better Serve e-Mobility and Energy Storage Sectors
2023/4/18: ITRI: 2023 ITRI Net Zero Day Brings Industry Technological and Financing Solutions for Net Zero Emissions by 2050
2023/4/13: Holst Centre: TNO at Holst Centre and ZSW announce Li-ion battery collaboration
2023/4/13: IME: Transforming the Future of Healthcare: Singhealth and A*STAR Partner to Foster Healthcare Innovations
2023/4/13: CEA-Leti to Report Progress on 3D Interconnects for Wafer-Level Platforms
2023/4/4: Rapidus, Japan’s newly founded chip manufacturer, joins imec’s Core Partner Program
2023/4/3: SRC Opens 2023 Call for Research

2023/3/15: NMI: Nexperia introduces in-vehicle network ESD protection portfolio for 24 V board net systems
2023/3/1: SRC: Microelectronics & Advanced Packaging Technologies Roadmap

2023/2/28: Imec’s virtual fab underpins strategies to reduce the carbon footprint of lithography and etch process steps
2023/2/20: Imec demonstrates low-power phase-locked loop for short-range automotive and industrial radar applications
2023/2/2: IMEC: Smaller, better, faster: imec presents chip scaling roadmap

2023/1/31: Imec demonstrates the co-integration of its high-quality SiN waveguide technology with its active silicon photonics platform
2023/1/30: CEA-Leti’s recent advances on key AR building blocks, e.g. retinal projection and holography
2023/1/27: Imec hyperspectral camera paves the way for in-vivo detection of low-grade gliomas
2023/1/26: Imec demonstrates combined VIS & NIR spectral camera system, complemented with hi-res RGB imaging, for data acquisition at video rate
2023/1/24: IMEC: IoSA, a new spin-off of UAntwerp and imec, develops animal behavior monitoring tool for research, conservation, and agriculture purposes
2023/1/19: LETI: Electric vehicles: CEA and Renault Group develop a very high efficiency bidirectional on-board charger
2023/1/4: SRC Launches JUMP 2.0 Consortium Aimed at Leap-Ahead Microelectronics Revolution

2022/12/20: IMEC: 100-fold current density enhancement puts imec’s nanomesh electrodes in pole position for high-throughput electrochemical applications
2022/12/15: NMI: Download the Flexciton presentation from the Fab Management Forum 2022
2022/12/8: Imec enables tight standard cell boundary scaling using a two-level semi-damascene integration scheme
2022/12/8: Leti: Path Towards Full Fault-Tolerant Quantum Computing with Si-Based VLSI Technologies In Plenary Talk at IEDM 2022
2022/12/7: CEA-Leti Presents RRAM’s ‘Promising Advantages’ For Neuromorphic/In-Memory Computing at IEDM 2022
2022/12/6: Imec and Rapidus sign Memorandum of Cooperation to collaborate on advanced semiconductor technologies
2022/12/6: Imec introduces simulation framework to better predict thermal transport in RF devices for 5G and 6G.
2022/12/6: NMI: Zuken and CSA Catapult Present Results of an R&D Collaboration for the Optimization of Tools for the Design of Power Modules
2022/12/5: Imec improves ferroelectric response and endurance of HZO-based ferroelectric capacitors

2022/11/25: ITRI Announces Its Collaboration with K&S in Hi-CHIP Alliance
2022/11/17: ITRI Partners with LITEON to Strength IPR Strategic Position
2022/11/16: ITRI Introduces High Resolution Full-Color Micro LED Display for AR Glasses
2022/11/10: ITRI Introduces Point-of-Care AI-DR Software for Rapid Diagnosis of Diabetic Retinopathy and Diabetic Macular Edema

2022/10/27: ITRI and URE’s Easy-Dismantled Solar Panel Module Certified by TÜV Rheinland
2022/10/20: ITRI and Ganvix, Inc. Extend Their Joint Venture to Commercialize Innovative Laser Technology
2022/10/19: IME: Seven parties commit to help businesses navigate towards environmental sustainability with Green Compass
2022/10/14: LETI: CEA & Schneider Electric Extend R&D Collaboration
2022/10/13: Imec demonstrates flat-panel-display-compatible pMUT technology for emerging ultrasound applications
2022/10/10: IME: Fujitsu Asia and A*STAR sign master research collaboration agreement to advance AI and converging technologies
2022/10/6: IME: FairPrice Group and A*STAR launch pilot for Smart Bins to encourage households to recycle more and recycle correctly
2022/10/6: NMI: STMicroelectronics build new plant in Italy
2022/10/3: NMI: SFN looks to end monopoly of Taiwanese and Korean chip producers with ‘Infrastructure Time Machine’ that enables fabs to reduce semiconductor production times 10 fold and increase net profit 40-50 times

HOME