Global SemiConsortium
- Holst Centre：
- オランダのTNO (応用科学研究機構)とベルギーのIMECが共同で設立した研究所。フィリップス社の研究センターの跡地に設置。
- IME (Institute of Microelectronics)- A*STAR：
- シンガポールの科学技術研究庁 (A*STAR)傘下にある半導体研究所。LSIプロセスから実装 (3D IC)に至るまで、SiだけではなくGaNやSiCについても研究している。
- IMEC (Interuniversity Microelectronics Centre)：
- ベルギーにある半導体技術の研究所。世界中から人材が集まり、半導体の設計、製造、応用などについて研究する。
- ITRI (Industrial Technology Research Institute )：
- 1973年に台湾で設立された研究開発機構。科学技術の研究開発により、産業発展と経済価値を創造し、社会福祉を促進することをミッションとする。
- LETI (Laboratoire d'Electronique des Technologies de I'information)：
- フランスの科学技術庁CEAの中にある電子情報技術研究所。STMicroelectronicsなどと密に活動している。MEMS技術は定評がある。
- NMI (National Microelectronics Institute)：
- 英国の半導体企業が集まる非営利の業界団体。
- SRC (Semiconductor Research Corp)：
- 米国の半導体研究を推進する大学のコンソーシアム。
- 2024/12/12
- Imec proposes 3D charge-coupled device with IGZO channel as buffer memory for data-intensive compute applications
- 2024/12/12
- CEA-Leti Demonstrates Embedded FeRAM Platform Compatible with 22nm FD-SOI Node
- 2024/12/10
- Holst Centre: Pioneering innovations in Organ-on-Chip technology
- 2024/12/10
- Imec demonstrates core building blocks of a scalable, CMOS-fab compatible superconducting digital technology
- 2024/12/9
- Imec achieves seamless InP Chiplet integration on 300mm RF Silicon Interposer with excellent performance at 140GHz
- 2024/12/9
- CEA-Leti Device Integrates Light Sensing & Modulation, Bringing Key Scalability, Compactness and Optical-Alignment Advantages
- 2024/12/7
- Imec proposes double-row CFET for the A7 technology node
- 2024/11/13
- IMEC: Skinetix, a new spin-off from imec and Vrije Universiteit Brussel (VUB), develops smart sportswear to maximize athletes’ performance and speed up post-injury recovery
- 2024/11/8
- ITRI Joins Forces with EU 6G-SANDBOX for Advanced 6G R&D
- 2024/10/31
- SRC: Failure Characterization of Beyond-CMOS Materials & Devices
- 2024/10/24
- Holst Centre: The impact of Bluetooth Low Energy (BLE) on IoT Solutions
- 2024/10/25
- Imec Cambridge UK gets off to a flying start with a funded project to develop cutting-edge Design Space Exploration (DSE) framework for AI training
- 2024/10/15
- CEA-Leti Launches OpenTRNG, an Open-Source Project For True Random Number Generators Using Ring-Oscillator-Based Architectures
- 2024/10/10
- IMEC: Arm, ASE, BMW Group, Bosch, Cadence, Siemens, SiliconAuto, Synopsys, Tenstorrent and Valeo commit to join imec’s Automotive Chiplet Program
- 2024/9/30
- IME: New AI Centre Of Excellence To Drive Innovation In Manufacturing
- 2024/9/26
- LETI: New CEA-Leti Technology Improves DC-DC Converter Efficiency and Paves the Way to Piezoelectric Converters Without Transformers
- 2024/9/19
- IMEC: Lithium-metal battery with novel solid electrolyte achieves 1070 Wh/L through cost-effective manufacturing process
- 2024/9/9
- IME: A*STAR and Applied Materials Announce New Joint Lab for Semiconductor Equipment and Local Supply Chain Development
- 2024/8/7
- Imec demonstrates logic and DRAM structures using High NA EUV Lithography
- 2024/8/6
- ITRI and Amicoipet Biotech’s Smart Pet Collar Bags Gold Medal at Concours Lépine
- 2024/8/5
- IMEC: Next-generation sensor for multi- and hyperspectral imaging from space sets new standard in light sensitivity and spectral range
- 2024/7/24
- Imec achieves record-low charge noise for Si MOS quantum dots fabricated on a 300mm CMOS platform
- 2024/7/23
- ITRI and Industry-Academia-Research Team Showcase Advanced 6G Innovations at 2024 EuCNC & 6G Summit
- 2024/7/10
- LETI: X-Ray Diffraction: Introducing a new era in threat detection
- 2024/6/28
- CEA-Leti Announces Launch of FAMES Pilot Line As Part of EU Chips Act Initiative
- 2024/6/27
- IMEC: New leap in Belgian quantum communication infrastructure: imec, UGent and Belnet realise first QKD links
- 2024/6/21
- CEA-Leti Presents Complementary Developments In 3D Integration Technologies for More Than Moore & Radio Frequency Devices At VLSI Conference
- 2024/6/19
- Imec introduces best-in-class ADCs for base stations and smartphones, propelling beyond-5G communications
- 2024/6/18
- Imec demonstrates functional monolithic CFET devices with stacked bottom and top contacts
- 2024/6/3
- Imec and ASML open joint High NA EUV Lithography Lab offering an early development platform to the leading-edge semiconductor ecosystem
- 2024/5/31
- CEA-Leti Reports Three-Layer Integration Breakthrough for AI-Embedded CMOS Image Sensors
- 2024/5/29
- Imec demonstrates die-to-wafer hybrid bonding with a Cu interconnect pad pitch of 2µm
- 2024/5/21
- IMEC: Crucial role for imec in EU Chips Act
- 2024/4/26
- IME: NTU Singapore, ExxonMobil and A*STAR Launch S$60 Million Corporate Lab For Low Carbon Solutions
- 2024/4/25
- Holst Centre: TNO develops first method for fully circular electronics
- 2024/4/16
- IME: Seatrium and A*STAR Explore New Energies and AI in Offshore and Marine Applications
- 2024/4/16
- ITRI Launches World-Class Certification Center for AIoT Applications in Partnership with Arm
- 2024/4/16
- NMI: TechWorks AI’ Launches at Iconic Bletchley Park Bringing Together AI & Deep Tech Industry Expertise
- 2024/4/4
- Holst Centre: TNO at Holst Centre develops ultrasound patch for organ monitoring
- 2024/3/31
- SRC: Partnering for Advances in AI Workloads
- 2024/3/25
- Imec demonstrates compact 32-channel silicon-based wavelength filter with low loss and high tuning efficiency
- 2024/3/20
- IME: Coca-Cola Singapore And A*STAR Debut New Robotic Solution, Scaling Automation Efforts Across Its Manufacturing Plant
- 2024/3/20
- NMI: GOV.UK: £35 million boost for British semiconductor scientists and businesses on international chip research
- 2024/3/13
- IMEC: Spanish government, region of Andalusia and imec sign Memorandum of Understanding (MoU) with the intention to establish a new 300mm R&D process line for specialized chip technologies
- 2024/3/12
- SRC: A Strategic Blueprint for Innovation
- 2024/3/7
- ITRI Establishes Southeast Asia Office to Foster Taiwan-Thailand Collaboration
- 2024/3/5
- Holst Centre: TactoTek and TNO at Holst Centre Partner to Advance In-Mold Structural Electronics (IMSE) and IMSE Circularity
- 2024/3/1
- IME: The Role of R&D In Singapore's Shared Future
- 2024/2/27
- IMEC: EU Consortium Developing Next-Gen Edge-AI Technologies Is Accepting Design Proposals
- 2024/2/27
- Imec presents levers to reduce the CO2 equivalent footprint of lithography and etch for advanced technology nodes
- 2024/2/26
- Holst Centre: From pills to pulses: Electrifying medicine using the peripheral nervous system
- 2024/2/26
- Imec demonstrates readiness of the High-NA EUV patterning ecosystem
- 2024/2/21
- Imec Unveils Breakthrough ADC Architecture for Very High-Speed Wireline Applications, Excelling in Area & Power Efficiency
- 2024/2/21
- CEA-Leti Develops Novel Architecture for Keyword-Spotting (KWS) In Always-On, Voice-Activated Edge-AI Systems
- 2024/2/20
- Imec pioneers unique, low-power UWB receiver chip: 10x more resilient against Wi-Fi and (beyond) 5G interference
- 2024/2/19
- Imec introduces compact wireless powering technology featuring record low energy consumption
- 2024/2/16
- Imec launches the first design pathfinding process design kit for N2 node
- 2024/2/2
- ITRI Partners with Mexico’s Sonora to Foster Science Park Development
- 2024/1/26
- ITRI and Intel Taiwan Unveil Cutting-Edge Joint Lab for HPC Cooling Certification
- 2024/1/26
- CEA-Leti Papers at Photonics West Report Progress Towards MicroLED Bandwidth and Efficiency Improvement
- 2024/1/17
- ITRI and TSMC Collaborate on Advancing High-Speed Computing with SOT-MRAM
- 2024/1/17
- NMI: Infinitesima Limited Completes Investment Round Ramps production of Metron3D to address market for in-line sub-nanometer 3D process control of advanced semiconductors
- 2024/1/4
- IMEC: Perovskite LEDs, a thousand times brighter than OLEDs
