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Global SemiConsortium

Global SemiConsortium

Holst Centre：: オランダのTNO（応用科学研究機構）とベルギーのIMECが共同で設立した研究所。フィリップス社の研究センターの跡地に設置。
IME（Institute of Microelectronics）：: シンガポールの半導体研究所。LSIプロセスから実装(3D IC)に至るまで、SiだけではなくGaNやSiCについても研究している。
IMEC（Interuniversity Microelectronics Centre）：: ベルギーにある半導体技術の研究所。世界中から人材が集まり、半導体の設計、製造、応用などについて研究する。
LETI（Laboratoire d'Electronique des Technologies de I'information）：: フランスの科学技術庁CEAの中にある電子情報技術研究所。STMicroelectronicsなどと密に活動している。MEMS技術は定評がある。
NMI（National Microelectronics Institute）：: 英国の半導体企業が集まる非営利の業界団体。
UAlbany：: 米ニューヨーク州立大学アルバニー校。半導体製造に力を入れ、世界の半導体研究の拠点の一つになっている。ニューヨーク州が熱心に資金提供。
SRC（Semiconductor Research Corp）：: 米国の半導体研究を推進する大学のコンソーシアム。
SEMATECH（Semiconductor Manufacturing Technology）：: 半導体プロセスの研究開発を行う米国のコンソーシアム。

2019/7/19: Holst Centre: Creating a sustainable future
2019/7/18: Leti: Weebit Nano and CEA-Leti to demonstrate brain-inspired neuromorphic demo
2019/7/10: CEA-Leti and UnitySC Announce Further Development To Fuel Industry 4.0 with Smarter Tools
2019/7/8: Imec world first to demonstrate 2 Metal layer back-end-of-line for the 3nm technology node
2019/7/3: Leti: CEA’s Precise Localization Technology Boosts Quality Control and Efficiency in Desoutter’s Products

2019/6/27: Leti: CEA-Leti & Radiall to Design Innovative RF Components for 5G Networks and Photonics Components for Harsh Environments
2019/6/25: Leti: Light Communications Alliance formed by Global Industry Leaders
2019/6/19: Leti: Miniaturized chemical sensor integrated on silicon
2019/6/18: Imec, partner in EnergyVille, doubles energy density of its solid-state batteries to 400Wh/liter
2019/6/13: Imec presents a manufacturable solution for field-free switching operation of Spin-Orbit Torque MRAM devices
2019/6/12: Imec demonstrates optimized process flows for high performance Ge-based devices
2019/6/11: Ualbany: SUNY Poly Next-Gen Transistor Research Featured in Advanced Materials
2019/6/11: CEA-Leti Announces Smart-Farm Project to Lower Greenhouse Gas Emissions & Boost Farming Efficiency
2019/6/6: Leti: Aledia invests in own R&D facility
2019/6/3: CEA-Leti and Silvaco Team Up on Yield-Prediction Project For Ultra-Low-Power Static Memories

2019/5/14: Imec and Bloomlife Showcase Prototype of World’s First Wearable 5-Channel ECG Chip to Monitor Fetal Heart Rate and Mobility
2019/5/14: CEA-Leti Develops CMOS Process for High-Performance MicroLEDs That Could Overcome Display-Size Obstacles
2019/5/13: A smart radar system for gesture recognition and non-contact vital signs monitoring.
2019/5/8: Holst Centre demos world's most transparent large-area optical fingerprint sensor
2019/5/6: Leti: Micro-coolers developed in Grenoble equip main ring at CERN

2019/4/24: Leti: SEMI Partners with Powerhouses imec, CEA-Leti and Fraunhofer to Energize Global Innovation
2019/4/8: Imec and Jolywood achieve a record of 23.2 percent with bifacial n-PERT solar cells
2019/4/4: Leti: Exploring in-memory computing
2019/4/3: Holst Centre: Helping flexible solar panels last longer. Holst Centre and DuPont Teijin Films develop production-ready barrier film solution for flexible photovoltaics
2019/4/2: Leti’s lensless microscope was adapted to enable 3D image acquisition

2019/3/19: CEA-Leti Announces Prototype of Next-Generation, Low-Cost Photo-Acoustic Sensors For Gas Detection And Analysis
2019/3/12: Imec: Novel nanomaterial promises improvements in batteries and many more sustainable applications
2019/3/5: Imec at Holst Centre designs breakthrough sub-mW radar for presence detection in smart buildings

2019/2/26: Imec: A miniature microfluidics heat sink For high-performance chip cooling
2019/2/26: Imec to install high NA EUV imaging and attosecond analytical lab to probe lithography down to 8nm pitch
2019/2/25: Imec: Sequential Infiltration Synthesis (SIS) significantly improves EUV patterning
2019/2/20: CEA-Leti and Stanford Target Edge-Ai Apps with Breakthrough NVM Memory Cell
2019/2/18: Imec Reports Two Record-Breaking Ringamp ADCs for 5G Base Stations and Mobile Handsets
2019/2/18: Imec designs breakthrough sub-mW radar for presence detection in smart buildings
2019/2/12: Imec and EnergyVille Present Unique Simulation Framework to Accurately Determine Energy Yield of Bifacial Solar Modules and Systems
2019/2/7: Ualbany: Times Union: IBM, SUNY Poly creating artificial intelligence center in Albany
2019/2/6: CEA-Leti combines integrated optics and holography in novel lens-free, augmented reality technology
2019/2/5: Ualbany: AIM Photonics News Release: AIM Photonics Announces Best-in-Class 300mm Silicon Photonics Multi-Project Wafer (MPW) Performance
2019/2/5: CEA-Leti builds prototype of next-generation mid-infrared optical sensors for portable devices

2019/1/31: Imec: Raman-on-Chip for High-Throughput, High-Resolution Handheld Spectroscopy
2019/1/24: Imec: New supercomputer boasts unparalleled computing power
2019/1/15: Imec and CARDIS partners develop unique photonic-based medical device for the screening of arterial stiffness and the diagnosis of cardiovascular diseases
2019/1/8: Holst Centre launches at CES 2019 disposable health patch to measure vital signs
2019/1/8: Imec and TNO launch comfortable, disposable health patch with long battery life to measure vital signs

2018/12/31: SRC: SK hynix joins acclaimed GRC and NST research programs
2018/12/21: Leti: Neural networks will soon be capable of incremental learning
2018/12/18: Imec: Europe secures Europractice services to European academia and industry until end 2021
2018/12/5: CEA-LETI Develops Circuits for Neuromorphic Processors That Replace CMOS Transistor-Based Tcam Memory With Rram-Based Tcam Memory
2018/12/3: Imec Improves Performance and Understanding of Stacked Nanowire Gate-All-Around Transistors for N3 and Beyond
2018/12/3: Imec Demonstrates the Feasibility of Introducing SST-MRAM as a Last-Level Cache at the 5nm Technology Node
2018/12/3: Imec first to stack FinFETS with 45nm fin pitch using sequential 3D integration
2018/12/3: Imec reports for the first time direct growth of 2D materials on 300mm wafers
2018/12/3: Imec and partners report major breakthroughs for spintronic logic devices in two different implementations

2018/11/20: Holst Centre: First ever industry demonstration of capacitive communication
2018/11/19: Imec, Ghent University and SEED Demonstrate Electronics in Hydrogel-based Soft Lenses
2018/11/19: Leti: Imec and CEA-Leti Join Forces on Artificial Intelligence and Quantum Computing
2018/11/15: Holst Centre: 15-meter roll-to-roll device is world's longest OLED
2018/11/13: Holst Centre and NovaCentrix light up flexible electronics integration
2018/11/13: Imec demonstrates first secure passive keyless entry solution for automotive using Bluetooth Low Energy
2018/11/12: Leti: High-performance, low-cost mid-infrared detectors for industry
2018/11/9: Ualbany: SUNY Poly SiC nanowire joint research with GlobalFoundries published by Nanomaterials
2018/11/8: IME: A*STAR IME's New Multi-Chip Fan-Out Wafer Level Packaging Development Line to drive Innovation and Growth in Semiconductor Industry
2018/11/8: SK hynix joins acclaimed GRC and NST research programs
2018/11/7: Ualbany: Synopsys News Release: In Partnership with AIM Photonics, Infinera Process Design Kit Available for Synopsys OptSim Circuit PIC Design Solution
2018/11/5: Imec Adds UV Sensing Capabilities to Its Portfolio of CCD-in-CMOS-based Time-Delay-Integration Imagers

2018/10/31: Imec Releases Neuropixels Neural Probe to the global Neuroscience Community
2018/10/25: CEA-Leti Middleware Will Be Core Of Fog Platform for Decentralized Cloud-To-Edge AI
2018/10/24: CEA-Leti & Taiwanese National Applied Research Laboratories Team up to Strengthen Microelectronics Innovation in France & Taiwan
2018/10/22: Imec and ASML Enter Next Stage of EUV Lithography Collaboration
2018/10/16: Imec: Pharrowtech boosts millimeter-wave fixed wireless access coverage
2018/10/8: Leti: World-class SOI prototyping line
2018/10/4: Ualbany: AIM Photonics News Release: AIM Photonics is Unveiling Support for Datacom and Telecom Optical Bands with its New Silicon Photonics Process Design Kit (PDK)

2018/9/27: Imec: New Program to Kick-start US and Asian scale-ups in Europe
2018/9/24: Imec’s screen printed large-area nPERT solar cells surpass 23 percent efficiency
2018/9/24: Imec: Perovskite/CIGS tandem cell with Record Efficiency of 24.6 percent Paves the Way for Flexible Solar Cells and High-Efficiency Building-Integrated PV
2018/9/24: Leti: STMicroelectronics and Leti Develop GaN-on-Silicon Technology for Power Conversion Applications
2018/9/20: Imec Taiwan and ITRC-NARLabs to collaborate on advanced imaging and optics applications
2018/9/18: Leti & EFI Automotive Launch Project To Improve Reliability And Speed Of Low-Cost Electronic Devices For Autos
2018/9/13: Ualbany: Times Union: SUNY Poly research team trying to make chips more like human brain
2018/9/13: Leti Announces EU Project To Develop Powerful, Inexpensive Sensors With Photonic Integrated Circuits
2018/9/12: Imec.xpand raises EUR 117 million to invest in innovative, early-stage ideas leveraging imec’s knowledge, expertise and infrastructure
2018/9/7: Imec: UGent and imec launch fiber optic sensing spin-off Sentea
2018/9/4: Imec: Plannen voor nieuwe smart health & food samenwerking van wereldformaat in Gelderland
2018/9/4: Leti: Presentations PDF LID 2018
2018/9/4: Leti and VSORA Demonstrate 3GPP New Radio (5G NR) on Multi-Core Digital Signal Processor

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