Global SemiConsortium

- Holst Centre:
- オランダのTNO(応用科学研究機構)とベルギーのIMECが共同で設立した研究所。フィリップス社の研究センターの跡地に設置。
- IME(Institute of Microelectronics):
- シンガポールの半導体研究所。LSIプロセスから実装(3D IC)に至るまで、SiだけではなくGaNやSiCについても研究している。
- IMEC(Interuniversity Microelectronics Centre):
- ベルギーにある半導体技術の研究所。世界中から人材が集まり、半導体の設計、製造、応用などについて研究する。
- LETI(Laboratoire d'Electronique des Technologies de I'information):
- フランスの科学技術庁CEAの中にある電子情報技術研究所。STMicroelectronicsなどと密に活動している。MEMS技術は定評がある。
- NMI(National Microelectronics Institute):
- 英国の半導体企業が集まる非営利の業界団体。
- UAlbany:
- 米ニューヨーク州立大学アルバニー校。半導体製造に力を入れ、世界の半導体研究の拠点の一つになっている。ニューヨーク州が熱心に資金提供。
- SRC(Semiconductor Research Corp):
- 米国の半導体研究を推進する大学のコンソーシアム。
- SEMATECH(Semiconductor Manufacturing Technology):
- 半導体プロセスの研究開発を行う米国のコンソーシアム。
- 2021/3/30
- LETI: Enabling some of the world’s brightest color microdisplays
- 2021/3/26
- IME: HDB and A*STAR Ink Collaborations to Advance Smart Construction Technologies and Facilitate Partnerships in Technology Transfer
- 2021/3/24
- Leti: More resilient cybersecurity for IoT devices
- 2021/3/19
- Imec demonstrates an ultra-sensitive, small optomechanical ultrasound sensor in silicon photonics
- 2021/3/11
- CEA-Leti Previews the Future of Retinal Projection In Four Papers at Photonics West 2021
- 2021/3/10
- Holst Centre: dpiX and TNO at Holst Centre Sign MOU to Formalize Partnership
- 2021/3/8
- CEA-Leti Envisions Widespread Use of LiDAR Systems Based on Integrated Optical Phased Arrays (OPAs)
- 2021/3/5
- IMEC: Cardiology Prepared For The Fourth Dimension
- 2021/3/3
- Holst Centre: TNO at Holst Centre launches 3D battery spinoff LionVolt
- 2021/2/16
- Imec Showcases World’s First Sub-5mW, IEEE 802.15.4z Ultra-Wideband Transmitter Chip
- 2021/2/11
- Leti: Legrand and CEA combine their expertise to develop a new generation wireless and batteryless switch
- 2021/2/9
- Imec Demonstrates 20nm Pitch Line/Space Resist Imaging with High-NA EUV Interference Lithography
- 2021/2/9
- CEA-Leti Announces EU Project to Create Dynamically Programmable Wireless 6G Environments
- 2021/2/4
- Leti: New EU Quantum Flagship consortium launches a project on silicon spin qubits as a platform for large-scale quantum computing
- 2021/2/4
- Leti: French Team on Route Towards an Interposer Prototype for Quantum And Control Chips Integration at Very Low Temperature
- 2021/2/3
- Leti: CEA Is the First Research Center to Acquire A Cryogenic Prober for Testing Quantum Bits
- 2021/2/2
- Leti: New EU Quantum Flagship consortium launches a project on silicon spin qubits as a platform for large-scale quantum computing
- 2021/2/2
- Leti: French Team on Route Towards an Interposer Prototype for Quantum And Control Chips Integration at Very Low Temperature
- 2021/2/2
- CEA-Leti Team Paves the Way for Massive Integration of Qubits, Critical for Achieving Quantum Supremacy
- 2021/2/1
- SRC Newsletter: January Issue
- 2021/2/1
- SRC Connections at 2021 ISSCC
- 2021/1/28
- The NMI Member Product Catalogue is an opportunity for our members to promote their products and services to the TechWorks communities.
- 2021/1/26
- Imec: How working with imec’s hyperspectral experts helped fast-track success for the French startup, Tridimeo
- 2021/1/26
- CEA-Leti Reports Breakthrough High-Performance Gyroscope For Automotive, Aeronautic and Industrial Applications
- 2021/1/21
- Holst Centre: Discover our new Executive Report
- 2021/1/19
- CEA-Leti Reports Machine-Learning Breakthrough That Opens Way to Edge Learning
- 2021/1/12
- Looking back on imec’s highlights from 2020
- 2020/12/18
- CEA-Leti Scientists Present In-Memory Computing Pathways for Edge-AI & Neural Networks with 3D Architectures & Resistive-RAM
- 2020/12/17
- Imec presents smallest finFET-based biosensor for high-sensitivity molecule detection
- 2020/12/16
- Leti: Aledia Announces it Has Produced its First Nanowire Chips on 300mm Silicon Wafers Using CEA-Leti Pilot Lines
- 2020/12/15
- Imec Demonstrates Capacitor-less IGZO-Based DRAM Cell With >400s Retention Time
- 2020/12/15
- CEA to Enable High-Performance Processors That Will Power Exascale Computing
- 2020/12/9
- Imec Presents a Thin-Film Short-Wave-InfraRed Image Sensor with Sub-2µm Pixel Pitch
- 2020/12/3
- Imec Applies Photolithography To Push Functionality and Reliability Barriers In OLED Display Manufacturing
- 2020/11/26
- Imec and XIMEA launch industrial grade hyperspectral camera solution addressing the high-quality standards for machine vision applications
- 2020/11/18
- Imec: New imec research program pursues the development of scalable and energy-efficient 6G device technology
- 2020/10/29
- CEA-Leti to Build Quantum-Photonics Platform to Ensure Ultra-Secure Data for Finance, Energy, Defense and Other Industries
- 2020/10/28
- Holst Centre: Advanced interactive surfaces by TNO at Holst Centre: consoles and control panels re-invented
- 2020/10/27
- CEA-Leti Announces Collaboration with Intel to Advance Chip Design Through Cutting-Edge 3D Packaging Technologies
- 2020/10/23
- Imec begins developing SARS-CoV-2 test to identify positive cases and confirm whether someone is contagious in less than five minutes
- 2020/10/20
- Holst Centre: TNO at Holst Centre part of Madras project, a new European consortium
- 2020/10/13
- CEA Achieves Mass-Spectrometry Breakthrough that Paves the Way to Detecting Viruses
- 2020/10/9
- Imec presents alternative metals in advanced interconnect and contact schemes as a path to 2nm technology nodes
- 2020/10/3
- Leti: Light Communications Alliance formed by Global Industry Leaders
- 2020/10/3
- Leti and Partners in PiezoMAT Project Develop New Fingerprint Technology For Highly Reliable Security and ID Applications
- 2020/10/2
- NMI: The NMI Directory 20/21 is now available to download
- 2020/8/28
- Holst Centre: InSCOPE project boosts printed electronics past the research phase
- 2020/8/4
- Imec presents low-power 60 GHz radar chip for contactless health tracking in battery-powered devices
- 2020/7/22
- Imec: Five trends that will shape the future semiconductor technology landscape
- 2020/7/21
- Leti: HORIBA Medical and CEA-Leti to develop tomorrow’s diagnostics at the point of care.
- 2020/7/15
- Holst Centre’s near infrared vein detection sensor takes biometric security to a new level
- 2020/7/14
- Imec: University of Antwerp and imec launch Crowdscan, a new spin-off to measure crowds without compromising personal privacy
- 2020/7/8
- Imec and GLOBALFOUNDRIES Announce Breakthrough in AI Chip, Bringing Deep Neural Network Calculations to IoT Edge Devices
- 2020/7/1
- Leti: New consortium to develop a 5G and beyond strategic roadmap for future European connectivity systems and components
- 2020/6/24
- Holst Centre: The Province of Noord-Brabant, Economic Affairs & Climate Policy and TNO invest in Holst Centre’s new generation battery technology
- 2020/6/24
- IME: SingHealth and A*STAR co-developed smart chatbot to enhance care for COVID-19 patients at community care facilities
- 2020/6/23
- Imec: Deltaray enables zero-defect product manufacturing
- 2020/6/23
- Leti: EU Team Demonstrates Full Data-Transfer Silicon Photonics Module Delivering 100 Gb/s and Develops Building Blocks for Tb/s
- 2020/6/22
- CEA-Leti Scientists Demonstrate CMOS Device Fabrication at 500°C, Paving the Way to High-Performance 3D Monolithic CMOS Integration
- 2020/6/19
- Holst Centre creates method for effective production of electrolytes for solid-state batteries
- 2020/6/16
- Imec Overcomes Fundamental Operation Challenge for Voltage-Controlled Magnetic Random-Access Memories (RAM)
- 2020/6/15
- Imec Demonstrates Excellent Performance of Si FinFET CMOS devices with Integrated Tungsten Buried Power Rails
- 2020/6/15
- CEA-Leti Demonstrates Breakthrough Architecture for HPC Devices Using Gate-All-Around Nanosheet Fabrication Process
- 2020/6/11
- CEA-Leti Researchers Breakthrough put Record for LiFi Communications Using Single GaN Blue Micro-Light-Emitting Diode
- 2020/6/10
- NMI: Moortec Launches New In-Chip Technology
- 2020/6/9
- Holst Centre: Nederlandse uitvinding spatial Atomic Layer Deposition (sALD) van groot belang voor mondiale hightech industrie
- 2020/5/19
- Imec combines advanced machine learning algorithms and innovations in chip design to achieve cm accuracy and low-power ultra wideband localization
- 2020/5/13
- Imec: Lopos, a spin-off of imec and the Ghent University, presents the SafeDistance wearable that helps employees follow social distancing guidelines
- 2020/5/8
- Ualbany: SUNY Poly's Dr. Spyridon Galis' 'Engineered telecom emission and controlled positioning of Er3+ enabled by SiC nanophotonic structures' research published in Nanophotonics
- 2020/5/7
- CEA-Leti Explores Technology Roadmap For Sixth-Generation Wireless Networks in mmWave Bands
- 2020/5/5
- Imec: Roswell Biotechnologies and Imec to Develop First Molecular Electronics Biosensor Chips for Infectious Disease Surveillance, Precision Medicine and DNA Storage
- 2020/5/5
- Leti: A wireless detonation system designed to increase productivity and safety at open pit mines